— Definitions —
ADC — Analog-to-Digital Converter
ASK — Amplitude Shift Keying Modulation
BDM — Background Debug Mode
CAN — Controller Area Network
CDIP — Ceramic Dual In-Line Package
CLCC — Ceramic Leaded Chip Carrier
COP — Computer Operating Properly (Watchdog Timer)
CPU16 — 16-bit Central Processor Unit (HC11 Compatible)
CPU32 — 32-bit Central Processor Unit (68000 Compatible)
CTM — Configurable Timer Module (Various Hardware Options)
DAB — Digital Audio Broadcasting
DIP — Dual In-line Package
DSPI — Deserial Peripheral Interface
EBI — External Bus Interface
ECT — Enhanced Capture Timer
eDMA — Enhanced Direct Memory Access Controller
eTPU — Enhanced Timing Processor Unit
eMIOS — Enhanced Modular Input Output System
eQADC — Enhanced Queued Analog-to-Digital Converter
eSCI — Enhanced Serial Communications Interface
FSK — Frequency Shift Keying Modulation
GPT — General-Purpose Timer Module (4 IC, 5 OC, 2 PWM)
HQFP — Heatsink Quad Flat Package
HSOP — Heatsink Small Outline Package
i — Input-Only Port Pins
i/o — Bidirectional Input and Output Port Pins
I
2
C — Inter-Integrated Circuit
IC — Input Capture
ISPI — Interval Serial Peripheral Interface
LQFP — Low-Profile Quad Flat Package (1.4mm thick)
LVI — Low-Voltage Interrupt
LVR — Low-Voltage Reset
MCCI — Multi-Channel Communication Interface (2 SCI, SPI)
MFT — Multi-Function Timer
MUX — Multiplexed
OC — Output Compare
OOK — On-Off Keying
PBGA — Plastic Ball Grid Array
PDIP — Plastic Dual In-Line Package
PEEP — Personality EEPROM
PEP — Personality EPROM
PLCC — Plastic Leaded Chip Carrier
PLL — Phase-Locked Loop
PQFP — Plastic Quad Flat Pack
PWM — Pulse-Width Modulation
QADC — Queued Analog-to-Digital Converter (10-bit)
PQFN — Quad Flat No-Lead Package
QFN — Quad Flat No-Lead Package
QFP — Quad Flat Package
QSM — Queued Serial Module (SCI + QSPI)
QSPI — Queued SPI
RTI — Real-Time Interrupt
SCI — Serial Communication Interface
SCIE — Enhanced SCI
SCIM — Single-Chip Integration Module
SDIP — Shrink Dual In-line Package
SIM — System Integration Module
SIML — Low-Power System Integration Module
SIOP — Simple Serial I/O Port
SOICN — Small Outline Package Narrow Body
SOICW — Small Outline Package Wide Body
SPI — Serial Peripheral Interface
ESPI — Enhanced SPI
SRAM — Standby RAM Module
SSOP — Shrink Small Outline Package
TPU — Time Processor Unit (16 Programmable Channels)
TPURAM — Standby RAM Module with TPU Emulation Capability
TQFP — Thin Quad Flat Package (1.0mm thick)
TSSOP — Thin Shrink Small Outline Package
UART — Universal Asynchronous Receiver/Transmitter
USB — Universal Serial Bus
— Pb-free —
AA — Pb-free 44 to 100 pin QFP
AB — Pb-free 112 to 288 pin QFP
AC — Pb-free 16 to 44 pin LQFP
AE — Pb-free 48 to 64 pin LQFP
AF — Pb-free 68 to 100 pin LQFP
AG — Pb-free 108 to 144 pin LQFb
AH — Pb-free 80 to 100 pin TQFP
AI — Pb-free FQFP
AJ — Pb-free CQFP
AE — Pb-free 22 to 64 pin PDIP
ED — Pb-free 6 yo 20 pin PDIP
EE — Pb-free PSDIP
EF — Pb-free 8 to 16 in SOIC
EG — Pb-free 16 to 28 pin SOIC WIDE
EH — Pb-free 132 pin PQFP
EI — Pb-free PLCC
EJ — Pb-free 8 to 24 pin TSSOP
EK — Pb-free 32 to 54 pin SOIC WIDE
EL — Pb-free 26 to 56 pin TSSOP
EN — Pb-free 8 to 24 pin SSOP
EO — Pb-free 26 to 56 pin SSOP
EP — Pb-free QFN & MLF (Exposed Pad)
ER — Pb-free CATV
ES — Pb-free SENSOR
ET — Pb-free RF (POWER CHIPS)
EU — Pb-free MAC PAAC
EV — Pb-free MFP (SOEIAJ)
FC — Pb-free QFN & MLF (Regular)
FE — Pb-free CerQuads
VK — Pb-free MAPBGA <=1.3mm (THINMAP) <.7mm Pitch
VL — Pb-free MAPBGA <=1.3mm (THINMAP) >.7mm Pitch
VM — Pb-free MAPBGA 1.6mm > .7mm Pitch
VN — Pb-free MAPBGA 1.6mm < .7mm Pitch
VO — Pb-free MAPBGA 1.35mm < .7mm Pitch
VP — Pb-free MAPBGA 1.36mm > .7mm Pitch
VR — Pb-free PBGA
VS — Pb-free FC-HiTCE LGA (without C5 sphere)
VT — Pb-free FC PBGA
VU — Pb-free FC-HiTCE
VV — Pb-free TBGA
VW — Pb-free HSOP
VX — Pb-free SMT
VY — Pb-free UNIBODY
— Package Designators —
B — Shrink DIP (70 mil spacing)
DW — Small Outline (Wide-Body SOIC)
DWB — Small Outline (Wide body SDIB) 0.65 pitch
FA — 7 x 7 mm Quad Flat Pack (QFP)
FB — 10 x 10 mm Quad Flat Pack (QFP)
FC — QFN Quad Flat Pack
FE — CQFP (windowed) — Samples Only
FN — Plastic Quad (PLCC)
FS — CLCC (windowed) — Samples Only
FT — 28 x 28 mm Quad Flat Pack (QFP)
FU — 14 x 14 mm Quad Flat Pack (QFP)
FZ — CQFP (windowed) — Samples Only
K — Cerdip (windowed) — Samples Only
L — Ceramic Sidebraze
P — Dual in-Line Plastic
PNA — PQFN Power QFN
PNB — PQFN Power QFN
PNC — PQFN Power QFN
PU — 14 x 14 mm Low-Profile Quad Flat Pack (LQFP)
PV — 20 x 20 mm Low-Profile Quad Flat Pack (LQFP)
S — Cerdip (windowed) — Samples Only
TM — Mechatronics Connector
VR — Plastic Ball Grid Array (PBGA) with PB-free solder balls
ZP — 27 x 27 mm Plastic Ball Grid Array (PBGA)
SG187–24
Rev 29
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