SHARP:Power Device Lineup

REG POWER DEVICES ■ Low Power-Loss Voltage Regulators ●TO-220 type (Ta = 25°C) Absolute maximum ratings Electrical characteristics Built-in functions current at OFF state ON/OFF control Power Package Variable output Output Input Output Output Dropout Low dissipation Lead forming dissipation Overcurrent Model No. Features current voltage voltage voltage voltage (W) protection protection Vo*3 precision VI-O*5 Overheat Io Vin available voltage (A) (V) (V) TYP. (%) (V) Package Pd*1 Pd*2 shape type*7 PQxxRD08J00H series 5, 9, 12 A PQ3RD083J00H ASO protection function 0.8 20 1.25 10 3.3 ±3 A PQ6RD083J00H 6.3 A Low dissipation current at PQxxRA11J00H series OFF state (Iqs : 1µA (MAX.)) 35 1.5 ±2.5 B 5, 9, 12 PQxxRD11J00H series ASO protection function 1 20 15 A 1.4 ±3 PQxxxRDA1SZH series ASO protection function, 24 5, 8, 9, 12 A low dissipation current at PQxxxRDA2SZH series OFF state (Iqs : 5 µA (MAX.)) 2 – – 3.3, 5, 9, 12 ±2.5 A 20 PQ3RD13J000H ASO protection function 3.3 ±3 A 1 PQxxxEF01SZH series Minimum operating input 1.4 1.5, 1.8, A voltage : 2.35 V (4 terminals) 10 15 PQxxxEF02SZH series 2 2.5, 3.3 A ±2.5 PQxxRF11J00H series 1 B General purpose 35 1.5 5, 9, 12 PQxxRH11J00H series 1.5 18 B PQ3RD23J000H 3.3 A ASO protection function 20 1.4 15 ±3 PQxxRD21J00H series A 2 5, 9, 12 PQxxRF21J00H series General purpose 35 B 1.5 PQ3RF23J000H 18 ±2.5 B High output current 3.3 PQ3RF33J000H 3.5 1.8 0.5 TO-220 B PQ070XF01SZH Minimum operating input 1 A voltage : 2.35 V (4 terminals) 10 PQ070XF02SZH 2 A 1.4 15 1.5 to 7 ±2*4 PQ070VK01FZH Minimum operating input 1 E voltage : 2.35 V (5 terminals) PQ070VK02FZH 2 E PQ15RW08J00H 0.8 1.25 10 A ASO protection function, PQ15RW11J00H minimum operating input 1 A voltage : 3.5 V 20 1.4 15 3.0 to 15 PQ15RW21J00H A 2 ±2.5*4 PQ150RWA2SZH ASO protection function – – A PQ20RX05J00H Variable output voltage, 0.5 C output ON/OFF control 24 10 3.0 to 20 PQ20RX11J00H C 1 1.25 PQ150VB01FZH Overheat shutdown circuit, E minimum operating input 17 12.5 1.5 to 15 PQ150VB02FZH voltage : 2.35 V (5 terminals) 2 E PQ30RV11J00H 1 15 o*6 B 1.5 ±2*4 6 PQ30RV21J00H 2 35 18 1.5 to 30 o* B Variable output voltage PQ30RV31J00H 3 2 20 o*6 B 6 PQ7RV4J0000H 4.6 10 1.8 18 1.5 to 7 o* B *1 At self-cooling *2 With infinite heat sink attached *3 The xx/xxx in the model No. refer to the output voltage values of the model (e.g. 05/050 for 5 V, 12/120 for 12 V, 015 for 1.5 V). *4 Reference voltage accuracy *5 Current ratings are defined individually. *6 o : Available by adding circuit *7 Refer to page 65 42

POWER DEVICES ●High output current type [TO-220 high heat radiation type, TO-3P type] (Ta = 25°C) Absolute maximum ratings Electrical characteristics Built-in functions ON/OFF control Power Variable output Output Input Output Output Dropout dissipation Package Overcurrent Model No. Features current voltage voltage voltage voltage (W) protection protection precision VI-O*4 Overheat Io Vin Vo voltage (A) (V) (V) (%) (V) Pd*1 Pd*2 PQ5EV3J0000H 3.5 High output current, TO-220 PQ5EV5J0000H minimum operating input 5 7 1.6 45 1.5 to 5 ±1*3 0.5 (heat sink voltage : 2.35 V exposure) PQ5EV7J0000H 7.5 *1 At self-cooling *2 With infinite heat sink attached *3 Reference voltage accuracy Power Devices/ *4 Current ratings are defined individually. Analog ICs ●Low output current type [TO-92 type] (Ta = 25°C) Absolute maximum Built-in ratings Electrical characteristics functions Power Output Input Output Output Dropout Package dissipa- Overcurrent Model No. Features current voltage voltage voltage voltage protection protection tion Overheat Io Vin Vo precision VI-O Pd*1 (A) (V) (V) TYP. (%) (V) (W) PQ033ES1MXPQ 3.3 0.4 0.15 16 (Io = 150 PQ050ES1MXPQ Low output current type with general purpose 5 mA) 0.52 ±2 TO-92 TO-92 package (for auxiliary power supply) PQ033ES3MXPQ 3.3 0.7 0.3 9 (Io = 300 PQ050ES3MXPQ 5 mA) *1 At self-cooling 43

REG POWER DEVICES ✩New product ■ Surface Mount Type Low Power-Loss Voltage Regulators ●SOT-23-5 type (Ta = 25°C) Absolute maximum ratings Electrical characteristics Built-in functions current at OFF state ON/OFF control Power Input Output Output Dropout Package Low dissipation dissipa- Overcurrent Model No. Features voltage current Output voltage voltage voltage protection protection tion Vo*2 Overheat Vin Io precision VI-O Pd*1 (V) TYP. (V) (A) (%) (V) (W) 1.8, 2.5, 2.8, 3.0, PQ1Uxx1M2ZPH series Compact, low output current 16 ± 2.0 3.3, 3.5, 5.0 (3.0 V 0.26 Compact, PQ1Xxx1M2ZPH series ceramic capacitor compatible 0.35 0.18 *3 output) (Io = SOT-23-5 9 60 mA) Compact, ceramic capacitor PQ1XAxx1MZPH series *4 ± 2.0 compatible, high reliability *1 When mounted on a board *2 The xx in the model No. refer to the output voltage values of the model (e.g. 50 for 5.0 V, 18 for 1.8 V). *3 1.5, 1.8, 2.5, 2.6, 2.7, 2.8, 2.9, 3.0, 3.3, 3.5, 3.7, 4.0, 4.5, 5.0 *4 1.5, 1.8, 2.5, 3.0, 3.3, 5.0 ●SOT-23L type (Ta = 25°C) Absolute maximum ratings Electrical characteristics Built-in functions current at OFF state ON/OFF control Power Output Input Output Output Output Dropout Package Low dissipation dissipa- Overcurrent Model No. Features current voltage current voltage voltage voltage protection protection tion Overheat Io Vin Io Vo*2 precision VI-O Pd*1 (A) (V) (A) (V) TYP. (%) (V) (W) Compact, surface mount type, low dissipation ± 2.7 0.26 PQ1RxxJ0000H series current at OFF state (Iqs : 0.1 µA (MAX.)) – 16 0.18 *3 (3.0 V output) (Io = 60 mA) Compact, surface mount type, high ripple 1.8, 2.5, 3.0, PQ1Kxx3M2ZPH series 9 0.4 ± 2.0 0.7 SOT-23L rejection, output current of up to 300 mA 3.3, 3.6, 5.0 0.3 – (3.0 V (Io = Compact, surface mount type, output current 1.5, 1.8, 2.5, PQ1KAxx3MZPH series 15 output) 300 mA) of up to 300 mA, ceramic capacitor compatible 3.3, 5.0, 9.0 *1 When mounted on a board *2 The xx in the model No. refer to the output voltage values of the model (e.g. 25 for 2.5 V, 47 for 4.7 V, 50 for 5.0 V). *3 1.8, 2.0, 2.3, 2.5, 2.7, 2.8, 2.9, 3.0, 3.2, 3.3, 3.4, 3.5, 3.7, 3.8, 4.0, 4.2, 4.4, 4.7, 4.9, 5.0, 5.2 ●SOT-89 type (Ta = 25°C) Absolute maximum ratings Electrical characteristics Built-in functions ON/OFF control current at OFF state Power Variable output Output Input Output Output Dropout Package dissipa- Low dissipation Overcurrent Model No. Features current voltage voltage voltage voltage protection protection tion Overheat Io Vin Vo*2 precision VI-O*3 Pd*1 voltage (A) (V) (V) TYP. (%) (V) (W) Compact, high radiation package, 1.5, 1.8, 2.5, PQ1Lxx3M2SPQ low dissipation current at OFF state 16 3.0, 3.2, 3.3, (Iqs : 1 µA (MAX.)) 5.0 ± 2.0 Compact, high radiation package, 0.3 (3.0 V low dissipation current at OFF state 1.5, 1.8, 2.5, output) PQ1LAxx3MSPQ (Iqs : 1 µA (MAX.)), ceramic 3.3, 5.0, 9.0 0.7 capacitor compatible 15 Compact, high radiation package, 1.5, 1.8, 2.5, PQ1LAxx5MSP series ± 2.0 ceramic capacitor compatible 3.3, 5.0 Ceramic capacitor compatible, PQ1LAX95MSPQ 1.5 to 9.0 ± 2.0*6 variable output voltage 0.5 Compact, high output current, 0.9 1.8, 2.5, ± 2.0 SOT-89 PQ1Mxx5M2SPQ ceramic capacitor compatible 3.3, 5.0 (5.0 V output) Ceramic capacitor compatible, PQ1MX55M2SPQ 9 1.3 to 5.0 ± 2.0*6 0.7 variable output voltage Reset signal output function*4, PQ1Nxx3MxSPQ 0.35 2.5, 3.3 ± 2.0 ceramic capacitor compatible Compact, ✩PQ1MGxx8MSPQ ceramic capacitor compatible 0.8, 1.0, 1.2 ± 2.0 – 0.8 6 Compact, ceramic capacitor ✩PQ1MGX38MSPQ compatible, variable output type 0.5 to 3.5 ± 2.0 – Compact, high radiation package, PQ2Lxxx2MSPQ 2 outputs 0.25/ch 9 *5 – 0.4 *1 When mounted on a board *2 The xx in the model No. refer to the output voltage values of the model (e.g. 25 for 2.5 V, 50 for 5.0 V). [Except PQ2Lxxx2MSPQ] *3 Current ratings are defined individually. *4 Reset detection voltage : 4.2 V, 3.8 V *5 Output voltage combination : 3.3/3.3 V, 3.3/2.5 V, 3.3/1.8 V, 3.3/1.5 V, 2.5/1.8 V, 2.5/1.5 V 44 *6 Reference voltage accuracy

POWER DEVICES ★Under development ●SC-63 type (Ta = 25°C) Absolute maximum ratings Electrical characteristics Built-in functions Output current at OFF state Overheat protection current Package Power Output Output ON/OFF control Low dissipation Taped package Input Dropout Variable output IO Model No. Features dissi- voltage voltage (A) voltage voltage Overcurrent pation VO*2 preci- protection Vin VI-O*5 Pd*1 (V) sion Package voltage (V) (V) 0.5 1 1.5 (W) TYP. (%) shape type*6 Reset signal generation function PQ07VR5MAPH series 10 1.5 to 7 ±2.0*3 F (input voltage drop detection) PQ3DZ53J000H F 3.3 PQ3DZ13J000H ASO protection function, low dis- F sipation current at OFF state (Iqs: PQxxDZ51J00H series 5 mA (MAX.)) F Power Devices/ 24 5, 9, 12 Analog ICs PQxxDZ11J00H series ±3.0 F Ceramic capacitor compatible, ASO protection function, low dis- 3.3, 5, PQxxxDNA1ZPH series sipation current at OFF state (Iqs: G 8, 9, 12 5 mA (MAX.)), solder dip compati- ble lead shape 0.5 Low dissipation current at OFF PQxxxDZ01ZPH series 9, 10 3.3, 5 F state (Iqs: 5 µA (MAX.)) PQxxxEZ5MZPH series F Minimum operating input voltage: 2.35 V 1.5, 1.8, PQxxxEZ01ZPH series F 2.5, 3.0, ±2.5*4 Minimum operating input voltage: 3.3 PQxxxEN01ZPH series 2.35 V, solder dip compatible lead G shape 1.5, 1.8, PQxxxENA1ZPH series ±2.5 G 2.5, 3.3 Minimum operating input voltage: 10 1.2, 1.5, 2.35 V, ceramic capacitor compat- ★PQxxxENA1ZPH series 1.8, 2.5, ±2.0 G ible, solder dip compatible lead 3.3 shape 1.5, 1.8, PQxxxENAHZPH series – – G 8 2.5, 3.3 SC-63 1.5, 1.8, PQxxxEZ1HZPH series 2.5, 3.0, 1.0 F Minimum operating input voltage: 3.3 ±2.5*4 2.35 V 1.5, 1.8, PQxxxEZ02ZPH series 0.5 F (2 A) 2.5 PQxxxFZ5MZPH series F Minimum operating input voltage: ±30 3.7 1.0, 1.2 1.7 V (Dual power supply type) mV PQxxxFZ01ZPH series F – PQxxxGN01ZPH series Minimum operating input voltage: G 1.7 V (Dual power supply type), 5.5 – ceramic capacitor compatible, sol- PQxxxGN1HZPH series der dip compatible lead shape G 0.8, 1.0, Minimum operating input voltage: 1.2 1.1 V (Dual power supply type), ★PQxxxGM02ZPH ±2.0 0.3 G ceramic capacitor compatible, (2 A) solder dip compatible lead shape PQ070XZ5MZPH series F Minimum operating input voltage: 2.35 V PQ070XZ01ZPH F Minimum operating input voltage: ±2.0*3 0.5 PQ070XN01ZPH 2.35 V, solder dip compatible lead G shape 10 1.5 to 7 PQ070XNA1ZPH G Minimum operating input voltage: 2.35 V, ceramic capacitor compat- PQ070XNAHZPH – G ible, solder dip compatible lead shape – ★PQ070XNB1ZPH ±2.0 G *1 With infinite heat sink attached *2 The xx/xxx in the model No. refer to the output voltage values of the model (e.g. 033 for 3.3 V, 05/050 for 5 V, 12/120 for 12 V). *3 Reference voltage accuracy *4 The value is defined as ± 50 mV in some models. *5 Current ratings are defined individually. *6 Refer to page 65 45

REG POWER DEVICES ★Under development ●SC-63 type (cont’d) (Ta = 25°C) Absolute maximum ratings Electrical characteristics Built-in functions Output current at OFF state Overheat protection current Package Power Output Output ON/OFF control Low dissipation Taped package Input Dropout Variable output IO Model No. Features dissi- voltage voltage (A) voltage voltage Overcurrent pation VO*2 preci- protection Vin VI-O*5 Pd*1 (V) sion Package voltage (V) (V) 0.5 1 1.5 (W) TYP. (%) shape type*6 PQ070XZ1HZPH 1.0 F Minimum operating input voltage: 10 1.5 to 7 ±2.0*3 2.35 V PQ070XZ02ZPH 0.5 F (2 A) PQ015YZ5MZPH Reference voltage (Vref): 1.0 V, F 1.0 to minimum operating input voltage: 3.7 ±3.0*3 1.5 PQ015YZ01ZPH 1.7 V (Dual power supply type) F Reference voltage (Vref): 0.6 V, – PQ035ZN01ZPH G minimum operating input voltage: ±30 1.7 V (Dual power supply type), 5.5 mV PQ035ZN1HZPH ceramic capacitor compatible, G solder dip compatible lead shape 0.8 to 3.5 Minimum operating input voltage: 1.1 V (Dual power supply type), ★PQ035ZM02ZPH ±2.0 0.3 G ceramic capacitor compatible, (2 A) 8 solder dip compatible lead shape PQ20VZ51J00H SC-63 F Minimum operating input voltage: 1.5 to ±2.0*3 4.5 V 20 PQ20VZ11J00H F PQ20WZ51J00H Minimum operating input voltage: F 3.5 V, ASO protection function, 3.0 to ±2.5*3 low dissipation current at OFF 20 PQ20WZ11J00H state (Iqs: 5 µA (MAX.)) F Minimum operating input voltage: 24 0.5 3.5 V, ASO protection function, low dissipation current at OFF 3.0 to PQ200WNA1ZPH state (Iqs: 5 µA (MAX.)) ceramic 20 capacitor compatible, solder dip compatible lead shape ±2.5*3 G Minimum operating input voltage: 3.5 V, low dissipation current at 5.0 to PQ200WN3MZPH OFF state (Iqs: 5 µA (MAX.)), 6.8 (0.3) 20 ceramic capacitor compatible, current limit: 800 mA *1 With infinite heat sink attached *2 The xx/xxx in the model No. refer to the output voltage values of the model (e.g. 033 for 3.3 V, 05/050 for 5 V, 12/120 for 12 V). *3 Reference voltage accuracy *4 The value is defined as ± 50 mV in some models. *5 Current ratings are defined individually. *6 Refer to page 65 46

POWER DEVICES ●TO-263 type (Ta = 25°C) Absolute maximum ratings Electrical characteristics Built-in functions current at OFF state ON/OFF control Power Taped package Variable output Output Input dissipa- Output Output Dropout Low dissipation Overcurrent Model No. Features current voltage tion voltage voltage voltage Package protection protection Vo*2 precision VI-O*4 Overheat Io Vin Pd*1 voltage (A) (V) (W) (V) TYP. (%) (V) 1.5, 2.5, PQxxxY053ZPH 3.3 1.0 5.0 PQ05VY053ZPH 1.5 to 5 1.0*3 High output current (minimum operating 7 input voltage : 2.35 V) 1.5, 2.5, PQxxxY3H3ZPH 3.3 1.0 3.5 Power Devices/ PQ05VY3H3ZPH 1.5 to 5 1.0*3 Analog ICs 35 0.5 TO-263 1.5, 1.8, PQxxxEH02ZPH ±2.5 2.5 2 A output (minimum operating input voltage : 2.35 V) 2.0 PQ070XH02ZPH 1.5 to 7 ±2.0*3 10 1.5, 1.8, PQxxxEH01ZPH ±2.5 2.5 1 A output (minimum operating input voltage : 2.35 V) 1.0 PQ070XH01ZPH 1.5 to 7 ±2.0*3 *1 With infinite heat sink attached *2 The xxx in the model No. refer to the output voltage values of the model (e.g. 015 for 1.5 V, 025 for 2.5 V, 033 for 3.3 V). *3 Reference voltage accuracy *4 Current ratings are defined individually. ●SOP-8 type (Ta = 25°C) Absolute Electrical characteristics Built-in maximum ratings functions Taped package Power Output Input Output dissipa- Overcurrent Model No. Features Output voltage Package current voltage voltage protection protection tion Overheat Vo Io Vin precision Pd* (V) TYP. (A) (V) (mV) (W) Built-in sink source function VDD x 1/2 PQ1DX095MZPQ (For DDR II memory) (VDDQ : 1.5 V (MIN.) ) – ±0.8 6 0.6 SOP-8 Built-in sink source function VDD x 1/2 PQ1DX125MZPQ ± 35 (For DDR memory) (VDDQ : 2.3 V (MIN.) ) * When mounted on a board 47

REG POWER DEVICES ★Under development ■ Surface Mount Type Chopper Regulators (DC-DC Converters) (Ta = 25°C) No. of Output type Built-in Input voltage Switch Output Oscillation Model No. Features output Step Step Inver- SW range current voltage frequency Package circuits down up sion Tr Vin (V) Isw (A) Vo (V) fo (Hz) TYP. • High voltage CMOS output : 30 V (MAX.) • White LED driver for back light PQ6CU11X1APQ • Output ON/OFF control function up to 5.5 — SOT-23-6 • Overvoltage/overcurrent protection circuits • Soft start function • High voltage CMOS output : 30 V (MAX.) • White LED driver for back light PQ6CB11X1AP (Capable of driving up to 4 LEDs in series connection) • Output ON/OFF control function 1.2 M • Overvoltage/overcurrent protection circuits • Soft start function 2.7 to 5.5 up to 30 USB-6 • High voltage CMOS output : 30 V (MAX.) 0.25*1 • White LED driver for back light PQ6CB11X1CP (Capable of driving up to 6 LEDs in series connection) • Output ON/OFF control function • Overvoltage/overcurrent protection circuits • Soft start function • High switching voltage : 40 V (MAX.) 300 k to PQ6CU12X2APQ • For tuner power supply 3.0 to 5.5 up to 36 SOT-23-6W • Output ON/OFF control function 800 k*7 • Possible to correspond also to operation in the minute lighting mode PQ7L2010BP • High frequecny PWM control for brightness adjustment up to 30 2M USB-10 • Output ON/OFF control function • PWM chopper regulator 2.7 to 5.5 • Sleep mode function Switchable between ★PQ5CB11X1AP (by switching between PWM and PFM) from 0.8 USB-6 • Overvoltage/overcurrent protection circuits 2.0 M and • Soft start function 1.2 M 0.8*1 • PWM chopper regulator (high oscillation frequency) • Output ON/OFF control function PQ1CZ38M2ZPH series VREF*2 300 k • Overcurrent/overheat protection circuits • For light load to 35*5 (step-down • PWM chopper regulator type)/ • Output ON/OFF control function 1 up to 40 –VREF*2 SC-63 PQ1CZ21H2ZPH • Overcurrent/overheat protection circuits 100 k to –30*5 • Low dissipation current at OFF state 1.5*1 (inverting (Standby crrent <ISD> : 1 µA (MAX.) ) type) • PWM chopper regulator (high oscillation frequency) PQ1CZ41H2ZPH • Output ON/OFF control function 300 k • Overcurrent/overheat protection circuits • Bootstrap system for high efficiency PQ1CX12H2ZPQ (Efficiency 90% (TYP.) ) • Low dissipation current VREF*3 to 24*5 • Bootstrap system for high efficiency up to 33 2.5*1 150 k (step-down (Efficiency 90% (TYP.) ) type) PQ1CX22H2ZPQ • Low dissipation current SOP-8 • Low voltage output : 1.2 V (MIN.) • Bootstrap system for high efficiency VREF*4 (Efficiency 91% (TYP.) ) to 24*5 ★PQ1CX41H2ZPQ • Low voltage output : 0.8 V (MIN.) up to 28 1.5* 1 (step-down 400 k • Ceramic capacitor compatible type) • PWM chopper regulator VREF*2 to 35*5 • Output ON/OFF control function (step-down type)/ PQ1CY1032ZPH • Overheat protection/overcurrent shutdown circuits –VREF*2 to –30*5 • High output current type (inverting type) up to 40 3.5*1 150 k TO-263 • PWM chopper regulator PQ1CYxx3HZPH series • Fixed output voltage : 3.3 V or 5 V 3.3, 5.0* 6 PQ1CYxx3LZPH series • Output ON/OFF control function (TYP.) • Overheat protection circuit • Soft start function • Undervoltage protection circuit (Determined 100 k to IR3M18N • Timer latch short-circuit protection circuit 2.2 to 6.0 by external 1 M*7 • Standby function Tr) (Determined • High transient load characteristics from External by external P-SSOP008-0150 built-in current control circuit Tr) 1.24 to • Soft start function IR3M19N • Overcurrent/overvoltage/undervoltage 4.5 to 22 input 220 k protection circuits voltage • Internal reference voltage accuracy (±1%) 48 *1 Peak current (absolute maximum ratings) *2 VREF nearly equal to 1.26 V (TYP.) *3 VREF nearly equal to 1 V (TYP.) *4 VREF nearly equal to 0.8 V (TYP.) *5 Output voltage variable range *6 The xx in the model No. refer to the output voltage values of the model (e.g. 33 for 3.3 V, 50 for 5.0 V). *7 Selectable oscillation frequency range

POWER DEVICES ★Under development ■ Surface Mount Type Chopper Regulators (DC-DC Converters) (cont’d) (Ta = 25°C) No. of Output type Built-in Input voltage Switch Output Oscillation Model No. Features output Step Step Inver- SW range current voltage frequency Package circuits down up sion Tr Vin (V) Isw (A) Vo (V) fo (Hz) TYP. • High efficiency synchronous rectified step-down converter • Current mode control (Determined 200 k/300 k/ ★IR3M56N • Soft start function 1 External 4.5 to 36 by 0.8 to 6.3 400 k/500 k/ P-TSSOP016-0225 • Overcurrent/overvoltage/undervoltage/overheat external Tr) external sync. protection circuits • Standby function (output ON/OFF control (Determined 100 k to function for each channel) IR3M17U 2.2 to 6.5 by external 500 k*3/ P-HQFN020-0404 • Soft start function Tr) external sync. • Undervoltage protection circuit (Determined • High efficiency two channel synchronous 2 External by 200 k/ rectified step-down converter external Tr) 300 k/ • Current mode control 400 k/ ★IR3M57N 4.5 to 36 0.8 to 6.3 500 k/ P-TSSOP028-0225 • Soft start function • Overcurrent/overvoltage/undervoltage/ external overheat protection circuits sync. • ON/OFF sequence setting 1*2 • Timer latch short-circuit protection circuit o*1 (when using 70 k to IR3M30M/U • Soft start function 2.7 to 5.5 internal Tr) 1M*3 • Overcurrent/undervoltage/overheat protection External circuits External setting External P-QFP048-0707/ 3 • ON/OFF sequence setting without external control o*1 0.4*2 (when using setting P-VQFN036-0505 • Timer latch phase fault protection circuit internal Tr) 70 k to IR3M58M/U • Soft start function 4.5 to 28 External 500 k*3 • Overcurrent/undervoltage/overheat protection External setting circuits *1 Built-in SW Tr can be used in step-up mode ; external SW Tr is required in step-down or inverting mode. *2 Constant current (MAX.) *3 Selectable oscillation frequency range ■ Chopper Regulators (DC-DC Converters) ●TO-220 type (Ta = 25°C) Absolute maximum ratings Electrical characteristics Power Output Switch Input dissipa- Output voltage Oscillation saturation Package Model No. Features current voltage frequency tion Vo*2 voltage Outline Isw Vin fo (kHz) Pd*1 (V) Vsat shape (A) (V) TYP. type*5 (W) (V) TYP. • PWM chopper regulator PQ1CG38M2FZH E (high oscillation frequency) 3 • Built-in overcurrent/overheat protection circuits 0.8* 300 0.9 • Output ON/OFF control function PQ1CG38M2RZH D • For light load PQ1CG21H2FZH • PWM chopper regulator E • Built-in overcurrent/overheat protection circuits 100 1.0 • Output ON/OFF control function PQ1CG21H2RZH D 1.5*3 PQ1CG41H2FZH • PWM chopper regulator VREF*4 to 35 E (high oscillation frequency) (step-down type)/ 40 14 300 0.9 • Built-in overcurrent/overheat protection circuits –VREF*4 to –30 PQ1CG41H2RZH • Output ON/OFF control function (inverting type) TO-220 D PQ1CG2032FZH • PWM chopper regulator E • Built-in overcurrent/overheat protection circuits 70 • Output ON/OFF control function PQ1CG2032RZH D 3.5*3 1.4 PQ1CG3032FZH • PWM chopper regulator E (high oscillation frequency) 150 • Built-in overcurrent/overheat protection circuits PQ1CG3032RZH • Output ON/OFF control function D • PWM chopper regulator 4.5 to 35 PQ2CF1J0000H 2.5*3 35 15 50 0.6 E • Built-in overcurrent/overheat protection circuits (step-up type) *1 With infinite heat sink attached *2 Output voltage variable range *3 Peak current *4 VREF nearly equal to 1.26 V (TYP.) *5 Refer to page 65 49

LSI POWER DEVICES ■ Power Supply ICs for CCDs/CCD Camera Modules No. of Input voltage Output Switching Switching Drive capacity Model No. output range voltage System frequency SW Tr current (mA) (pF) Package circuits (V) (V) (Hz) [Built-in SW Tr] [External SW Tr] 15 Step-up type PWM + REG Built-in 20 (DC) – 1M –8 Inverting type PWM External – 1 000 41WL-CSP*2 IR3M52Y7 5 2.7 to 5.5 2.5 to 3.3 REG 100 (DC) – 2.5 to 3.3 REG – – 100 (DC) – 1.8/1.2 REG 100 (DC) – 15 Charge pump 1.2 (DC) – 200 k – –8 Negative charge pump 2.5 (DC) – IR3M61U*1/63U 4.5 to 10 P-VQFN032-0505 3.3 Step-down type PWM + REG 120 (DC) – 1M Built-in 1.8 Step-down type PWM + REG 50 (DC) – 4 15 Step-up type PWM + REG Built-in 600 (DC) – Step-up, step-down, step-up/down type PWM 1M – 1 000 IR3M49U6 2.7 to 5.5 External P-VQFN036-0505 External setting Inverting type PWM – 1 000 REG – – 170 (DC) – 15/12 Charge pump 10/20 (DC) – 200 k – 1 IR3M55U* /59U 4.5 to 16 –8/–5 Negative charge pump 2/5 (DC) – P-VQFN032-0505 3.3 Step-down type PWM + REG 1M Built-in 150 (DC) – 3 15 Charge pump + REG 6 (DC) – 300 k IR3M48U6 2.7 to 3.2 –8 Negative charge pump + REG – 7 (DC) – P-VQFN032-0505 1.8 REG – 50 (DC) – *1 For automotive use *2 3.97 mm x 3.97 mm x 0.82 mm (TYP.) ■ Power Supply ICs for TFT-LCDs No. of Input voltage Output Switching Switching Drive capacity Model No. output range voltage System frequency SW Tr current (mA) (pF) Package circuits (V) (V) (Hz) [Built-in SW Tr] [External SW Tr] Step-up (20 V (MAX.) )/ Built-in step-down type PWM (Step-up type) 400 External 70 k to IR3M58M/U 4.5 to 28 setting Step-down type PWM External – 1 000 500 k Step-down, inverting type PWM External – P-QFP048-0707/ Step-up, step-down, Built-in P-VQFN036-0505 step-up/down type PWM (Step-up type) 1 000 – External Step-up, step-down, step-up/ 70 k to Built-in IR3M30M/U 3 2.7 to 5.5 setting down, inverting type PWM (Step-up type) 1 000 – 1M Step-up, step-down, step-up/ down, inverting type PWM External – 1 000 15.3 Charge pump – 0.1 (DC) – IR3M16U 2.6 to 3.6 5.1 Charge pump + REG 100 k – 5 (DC) – P-HQFN020-0404 –10.2 Negative charge pump – 0.1 (DC) – 50

POWER DEVICES ■ Fail Safe IC Operating voltage Dissipation current Operating temp. Model No. Features (µA) (°C) VBAT (V) VBAC (V) VIO (V) • Malfunction detection IR3T46U/46U6* • Built-in 8-bit ADC 3.2 to 4.5 3.0 to 3.3 2.6 to 3.0 TYP. 10 –20 to +85 • Built-in timer circuit • Built-in key detection output OR gate * 46U: Tray package 46U6: Taped package ■ LED Drivers ●Built-in step up circuit Power Devices/ Input Output No. of Number Booster Built-in Built-in voltage current 1 Oscillation constant * frequency Analog ICs Model No. Function Features output of current SW range (mA) (Hz) Package circuits LEDs method circuit Tr (V) MAX. TYP. 3 PQ6CU11X1APQ (Series *1 to 5.5 SOT-23-6 connection) • High voltage CMOS output: 30 V (MAX.) • Output ON/OFF control function 4 PQ6CB11X1AP (Series *1 1.2 M • Overvoltage/overcurrent protection circuits connection) White LED driver • Softstart function 1 PWM USB-6 for back light 6 250*2 1 PQ6CB11X1CP (for small panels) (Series * connection) 2.7 to 5.5 • Possible to correspond also to operation in the minute lighting mode 4 PQ7L2010BP • High frequency PWM control for brightness (Series *1 2.0 M USB-10 adjustment connection) • Output ON/OFF control function • I2C bus control • Illumination mode (64 levels/ch) RGB LED driver • Picture light mode (32 levels/ch) 155/ch IR2E46Y6 for picture lights • Brightness adjustment 3 3 PWM 2.7 to 4.5 (in picture 1.2 M 33WL-CSP*4 and illuminations • Standby function/soft start function light mode) • Overcurrent/undervoltage/overheat protection circuits • Independent current control for two systems White LED driver (4 outputs and 2 outputs) • LED non-connected judging function Charge IR2E47U6 for back light 6 4+2 – 2.7 to 5.5 20/ch 1M P-HQFN024-0404 pump (for small panels) • Brightness adjustment • Undervoltage/overheat protection circuits • Buit-in 150 mA driver for each channel • Step-up DC-DC output short-circuit White LED driver protection function for back light • Current driver output open detection 100 k to IR2E49U 5 40 PWM External 6 to 28 150/ch*2 P-VQFN036-0606 (for medium • Capable of external brightness adjustment 1 M*3 panels) using PWM input signal • Overcurrent/overvoltage/undervoltage/ overheat protection circuits • Capable of direct connection of ambient light sensor • Brightness adjustment by ambient LED driver for illuminance feedback (16-step ambient back light and illuminance/128-level illuminance) 3.0 to 4.5 call alert display (for main LCDs) 4 + 2 Charge (for drive)/ IR2E51Y6 9 – 25/ch 660 k 35WL-CSP*4 LED driver • Non-external coil thanks to charge pump drive + 3 pump 2.3 to 3.2 (auto brightness • Capable of driving 4 main-LEDs, 2 sub-LEDs, (for control) adjustment) and 3 call alert LEDs with a single device. • I2C interface • Standby function/power on reset function/ soft start function *1 Constant current (MAX.) *2 Use this IC within the range of power dissipation. *3 Selectable oscillation frequency range *4 3.57 mm x 3.57 mm x 0.82 mm (TYP.) 51

LSI POWER DEVICES ●External power supply for LEDs Supply voltage Model No. Function Features Package (V) • Output current (constant current sink output) : 30 mA (MAX.) (setup by external resistor) • Gradation function (clock cycle setting or external synchronization) IR2D20U 24-dot LED panel driver with • Independent current control for three systems (for RGB LED) 4.5 to 5.5 P-HQFN052-0707 constant-current sink outputs • LED drive voltage : 15 V • Rated output voltage : 20 V (MAX.) • fCLK : 20 MHz (MAX.)/16.6 MHz (MAX.) (at cascade connection) • Output current (constant-current sink output) : 60 mA (MAX.) 16-dot LED panel driver with (setup by external resistor) IR2D071 3.0 to 5.5 P-SDIP028-0400 constant current sink outputs • Rated output voltage : 7 V (MAX.) • fCLK : 20 MHz (MAX.)/16.6 MHz (MAX.) (at cascade connection) ■ Laser Diode Drivers Drive Maximum Applicable Supply Model No. Application Function output current SHARP voltage Package mode (mA) MIN. diode type (V) Built-in 100 mA driver, IR3C14N1 For Mini Disc players APC function DC mode 100 — 2.4 to 3.5 P-SSOP008-0150 Built-in APC function, P IR3C22N For CD/DVD players — 150 (Single power supply) 4.5 to 5.5 with inhibit input pin 52

ANALOG ICs ✩New product ★Under development ■ Video Interface ICs for TFT-LCDs Input signal LCD panel Serial Supply Power Color Model No. Composite Y/color Analog OSD decode ± power + power Low voltage Digital data voltage consumption Package video difference RGB (Digital) source source source input control (V) TYP. (mW) TYP. 4.5/12 or P-QFP048-0707 IR3Y18A1 NTSC/PAL 130 4.5/–7.5 P-QFP048-1010/ IR3Y26A2/A6 *3 – 140 P-QFP048-0707 5/7.5 IR3Y29A1/B1 NTSC/PAL 190 4.5/12 or IR3Y31M1 NTSC/PAL 160 4.5/–7.5 IR3Y34M1 – 3/12 88 IR3Y37A1 (Common terminal) – 3/6.5 106/88*5 P-QFP048-0707 Power Devices/ 3/12 or RB5P0010M2 *3 – 92 Analog ICs 3/4.5/–7.5 RB5P0020M2 (Common terminal) – 3/5 70/57*5 RB5P0050M2 (Common terminal) – 95/80*5 RB5P0060M2 NTSC/PAL 3/5/13 120 P-QFP048-1010 RB5P006AM2 NTSC/PAL RB5P0070M*1 NTSC/PAL 3/7 330 P-QFP072-1010 NTSC/PAL RB5P0090M *3 (automatic 5/13 250 P-QFP048-1010 identification) LRS5751*2 NTSC/PAL 3.3/5/7.5 197 NTSC/PAL P-LQFP100-1414 LRS5752*2 *3 (automatic 3.3/5/13 257 identification) NTSC/PAL/ ✩IR3Y63M *4 3.3/5 300 P-TQFP100-1414 (Built-in) SECAM *1 For digital signal input panels *2 Built-in timing generator *3 Two inputs *4 Digital RGB input is also available. *5 At analog input for RGB ■ Power Ampliﬁers for Wireless LAN Operating Supply Supply Output power Gain Detection Matching Model No. Application frequency voltage current Package (GHz) (V) TYP. (dBm) TYP. (mA) TYP. (dB) TYP. function circuit For 2.4 GHz wireless LAN 2.4 to 2.5 18 (at EVM 3%) (IEEE 802.11b/g) 105 30 – IRM046U7 P-HQFN024-0404 For 5 GHz wireless LAN 4.9 to 5.9 18 (at EVM 2%) (IEEE 802.11a) 140 25 – For 2.4 GHz wireless LAN Built-in (IEEE 802.11b/g) 2.4 to 2.5 18 (at EVM 3%) 130 29 (IN/OUT) ★IRM065U7 P-HQFN016-0303 For 5 GHz wireless LAN Built-in (IEEE 802.11a) 4.9 to 5.9 18 (at EVM 3%) 160 30 (IN/OUT) For 2.4 GHz wireless LAN* IRM047U7 (IEEE 802.11b/g) 3.3 18 (at EVM 3%) 105 30 – P-HQFN024-0404 ★IRM060U7 Built-in 2.4 to 2.5 16 (at EVM 2%) 75 28 (IN/OUT) For 2.4 GHz wireless LAN (IEEE 802.11b/g) P-HQFN010-0202A Built-in IRM063U7 18 (at EVM 3%) 120 30 (IN/OUT) IRM048U7 140 25 – P-HQFN024-0404 For 5 GHz wireless LAN (IEEE 802.11a) 4.9 to 5.9 18 (at EVM 2%) Built-in ★IRM053U7 150 31 (IN/OUT) P-HQFN010-0202A * Can be used as a power amp for PHS and DECT (1.9 GHz band), or as a driver amp for FWA (1.9 to 2.6 GHz band). 53

LSI ANALOG ICs ■ ICs for Audio Equipment Supply voltage Model No. Description Function Package (V) Built-in RF amp, ADIP detection circuit, IR3R55M1 connectable to hologram pickup RF amp IC 2.4 to 3.3 P-TQFP048-0707 for Mini Disc players Built-in 2x speed RF amp, ADIP detection circuit, IR3R58M1 connectable to hologram pickup IR3R59N1 Audio amp IC Built-in serial control input ATT and filter amp ±1.2 to ±3.25 P-SSOP024-0275 Laser diode driver IR3C14N1 for Mini Disc players Built-in 100 mA driver, APC function 2.4 to 3.5 P-SSOP008-0150 54

LSI PACKAGES ■ CSP ●CSP (Chip Size Package) The FBGA (commonly known as CSP) has an area array terminal structure with solder balls on the bottom, to give it a near chip-size footprint. This high-density, compact and low-profile package technology will greatly help in the design of compact mobile equipment, such as mobile phones and FBGA (CSP) digital cameras. ● Compact and lightweight Ability to create a near-chip size and lighter-weight package in comparison with conventional plastic packages. ● High reliability Comparable high reliability with that of conventional plastic packages. ● Mountability Features Conventional mounting system is available for CSP. SOP and QFP can be mounted together with CSP. Terminal pitch 0.8 mm 0.65 mm 0.5 mm 0.4 mm Packages Maximum terminal counts 288 (16 mm x 16 mm) 352 (16 mm x 16 mm) 424 (14 mm x 14 mm) 264 (10 mm x 10 mm) Nominal dimensions 6 mm x 6 mm to 16 mm x 16 mm 5 mm x 5 mm to 10 mm x 10 mm Gold wire Bare chip Mold resin Package height Cross 1.2 mm (MAX.)* section example Cu pattern Substrate Lead-free solder ball Diameter : 0.45 mm Terminal pitch : 0.8 mm 0.4 mm 0.65 mm 0.3 mm 0.5 mm 0.24 mm 0.4 mm * At 0.8 mm terminal pitch ●Wafer-level CSP The wafer-level CSP (WL-CSP) is a kind of chip-size package which is manufactured by assembling directly onto the finished wafer. ● Compact and thinner size It makes it possible to create an almost bare-chip-size and lighter-weight package. ● Mountability The conventional CSP mounting system can be also used in that of wafer-level CSP, which facilitates chip mounting more than bare-chip mounting does. It can be mounted together with other existing packages and Features passive components. (The use of underfill is recommended to improve the reliability of assembly.) Chip size* 4 mm x 4 mm 3.5 mm x 3.5 mm 3 mm x 3 mm 2.5 mm x 2.5 mm Pad pitch 0.5 mm 0.4 mm 0.5 mm 0.4 mm 0.5 mm 0.4 mm 0.5 mm 0.4 mm Maximum terminal counts 49 (7 x 7) 81 (9 x 9) 36 (6 x 6) 49 (7 x 7) 25 (5 x 5) 36 (6 x 6) 16 (4 x 4) 25 (5 x 5) * Rectangular chip form is also available. Cu pattern Bare chip Cross Package height section 0.5 mm to 1 mm example Passivation layer Lead-free solder ball 55

LSI PACKAGES ■ LGA ●LGA (Land Grid Array Package) The LGA package has basically the same structure as the CSP, enabling a thin package by removing the solder balls from the bottom of the package. The LGA package contributes to the compact and thinner design of applications, such as mobile phones and digital cameras. ● Lower package height Achieves 0.5 mm Max. in package height. ● High reliability Comparable high reliability with that of conventional plastic package. ● Excellent mountability Features Conventional mounting system is available for LGA. SOP and QFP can be mounted together with LGA. Terminal pitch 0.5 mm Maximum terminal count 216 (10 mm x 10 mm) Nominal dimensions 6 mm x 6 mm ~ 10 mm x 10 mm Mold resin Bare chip Gold wire Cross Package height section 0.5 mm (MAX.) example Substrate Land Cu pattern Terminal pitch : 0.5 mm 56

PACKAGES ■ SiP (System in Package) System in Package is an original SHARP high-density mounting technology that achieves high-density memory capacity and multiple functions by stacking multiple bare chips or multiple packages. This technology has two major streams. One method refers to a chip- stacked package technology that can achieve up to 5-chip mounting by stacking chips in a single package. The other method refers to a package stack technology with which it is possible to stack a package of over 5 chips, by stacking multiple packages in which 1 to 2 chips are stacked. The System in Package technology contributes to higher functionality of applications, such as mobile phones and digital cameras, as well as to reduction in size and weight. ●Chip Stacked CSP ● Wide variety of lineup It is possible to provide a wide lineup of stacked CSPs, including 2-chip, 3-chip, 4-chip and 5-chip stacked CSPs, to respond to customer needs. ● Compact and thinner size Encapsulating multiple bare chips into an existing plastic package contributes to decreasing the mounting area. In addition, SHARP's wafer thinning technology makes it possible to achieve 1.4 mm package height. Packages ● Multiple functions Multiple bare chips of different sizes and functions, such as logic LSIs and memories, can be incorporated Features in a single package, making possible multiple functions. ● Same-size chip stacking technology SHARP's stacking technology enables stacking of multiple same-size bare chips, contributing to higher memory density. (4-chip stacked CSP) When using a SHARP four-chip stacked CSP, the mounting area and weight of a package can be decreased by half in comparison with using two 2-chip stacked CSPs, or a 3-chip stacked CSP and a conventional CSP. (5-chip stacked CSP) Gold wire Bare chip Mold resin Cross Package height 1.4 mm (MAX.)* section 1.6 mm (MAX.)* example Cu pattern Substrate Lead-free solder ball Diameter : 0.45 mm Terminal pitch : 0.8 mm 0.30 mm 0.5 mm * At 0.8 mm terminal pitch ●Chip Stacked TSOP/QFP*/VQFN/HQFN ● Decreased mounting area By encapsulating two identical or different types of bare chips into a single conventional plastic package, the mounting area of the package can be decreased. ● Multiple functions Features Thanks to the incorporation of different sizes and functions of multiple bare chips, such as logic LSIs and memories, the functionality increases. ● Higher memory density When incorporating two identical memory bare chips into a single package, memory density doubles on the same mounting area. (TSOP, TQFP) Gold wire Bare chip Lead Package height 1.2 mm (MAX.) Cross section Bare chip Mold resin example (VQFN) Gold wire (HQFN) Gold wire Mold resin Mold resin Package height Package height 1.0 mm (MAX.) 1.0 mm (MAX.) * Including TQFP and LQFP. 57

LSI PACKAGES ●Package Stacked ● Multi stacking The package stacking technology makes it possible to increase the memory capacity and create a combined system with memory and logic LSI. In the case of combination memories, memory capacity can be increased by stacking multiple 0.5 mm height packages in which 1 to 2 chips are stacked. ● Decreased mounting area and height Features The package stacked technology makes it possible to decrease the mounting area by stacking multiple packages in which 1 to 2 chips are stacked, also achieving 1.5 mm height when six chips are stacked. ● Multiple functions Thanks to the combination of packages in which various kinds of LSIs are mounted, such as a memory and ASIC, achieving an increase in and enhancement of functionality is easy. Mold resin Mold resin LSI : 1 chip Gold wire LSI : 2 chips Substrate Substrate Through hole Through hole Gold wire Lead-free solder ball Lead-free solder ball Terminal pitch : 0.5 mm Terminal pitch : 0.5 mm LSI : 3 chips Gold wire Mold resin Substrate Lead-free solder ball Terminal pitch : 0.5 mm Cross Examples of 3D-SiP composition section • High-density combination memory (3-package stacking) example 6 chips 1.5 mm (MAX.) 2 chips 1.5 mm 2 chips (MAX.) 2 chips • System LSI (Logic LSI + Memory) (2-package stacking) 4 chips 3 chips 1.8 mm 1.8 mm (MAX.) 1 chip (MAX.) 58

PACKAGES ■ SOF ●SOF (System On Film) SOF is a highly flexible thin film package, created from SHARP’s TCP technologies. It can be easily bent, and contributes to thin and compact design of products. Peripheral circuit components can also be mounted. ● Highly flexible and thin film package By using highly flexible and thin film, SOF contributes to creating thin and compact products. It can also achieve finer terminal pitches and multiple outputs easily, and pattern layout on a film under the chip Features makes it possible to improve the flexibility of the pattern layout. ● Multiple chip mounting Plural bare chip mounting and incorporation of peripheral components contribute to the higher functionality of products. Packages Bare chip Cu pattern Cross section Solder resist Thickness 0.6 mm (MIN.) 1.0 mm (TYP.) 38 µm example Under fill material Gold bump Film width : W1 35 mm super wide 48 mm super wide 70 mm wide Maximum pattern layout area : W2 28.6 mm 41.6 mm 59.0 mm Maximum device pitch : L 15 sprockets Copper foil thickness 8 µm Copper foil type Rolled or electrolytic Copper foil plating Tin (Sn) Minimum pattern pitch 0.029 mm Sprocket hole : A 1.981 mm (wide) /1.42 mm (super wide) Sprocket hole : B 1.981 mm (wide) /1.42 mm (super wide) 4.75 mm Film Sprocket hole pitch specifications B A Maximum pattern layout area W1 W2 L Other components Bare chips and peripheral circuit components can be mounted on the film. In addition to the SOF described above, a conventional TCP (Tape Carrier Package) is also available. 59

LSI PACKAGES ★Under development ■ Package Lineup ●Surface-mount Type Package Terminal pitch Nominal dimensions Package width & length Appearance Package code No. of terminals x (seated height [MAX.]) type (Package material) mm mm mm LFBGA048-0606 6x 6 6.0 x 6.0 x (1.4) TFBGA048-0608 48 6x 8 6.0 x 8.0 x (1.2) TFBGA048-0808 8x 8 8.0 x 8.0 x (1.2) TFBGA056-0808 56 TFBGA060-0811 60 (48)* TFBGA064-0811 64 8.0 x 11.0 x (1.2) 8 x 11 TFBGA072-0811 72 (64)* LFBGA072-0811 8.0 x 11.0 x (1.4) / (1.6) TFBGA081-0808 81 8x 8 8.0 x 8.0 x (1.2) LFBGA085-0811 85 LFBGA087-0811 87 8 x 11 8.0 x 11.0 x (1.4) / (1.6) LFBGA088-0811 88 LFBGA088-0912 9 x 12 9.0 x 12.0 x (1.4) / (1.6) LFBGA090-0811 90 8 x 11 8.0 x 11.0 x (1.4) / (1.6) TFBGA096-1010 96 0.8 10 x 10 10.0 x 10.0 x (1.2) LFBGA107-0912 107 9 x 12 9.0 x 12.0 x (1.4) / (1.6) TFBGA111-1010 111 10 x 10 10.0 x 10.0 x (1.2) TFBGA112-1010 112 FBGA LFBGA115-0914 115 9 x 14 9.0 x 14.0 x (1.4) / (1.6) (CSP) LFBGA116-1010 116 10 x 10 10.0 x 10.0 x (1.4) / (1.6) LFBGA130-1013 130 10 x 13 10.0 x 13.0 x (1.4) / (1.6) TFBGA144-1111 144 11 x 11 11.0 x 11.0 x (1.2) TFBGA160-1212 160 12.0 x 12.0 x (1.2) LFBGA168-1212 168 12.0 x 12.0 x (1.4) / (1.6) 12 x 12 TFBGA180-1212 180 12.0 x 12.0 x (1.2) TFBGA184-1212 184 TFBGA240-1414 240 14 x 14 14.0 x 14.0 x (1.2) LFBGA280-1616 280 16 x 16 16.0 x 16.0 x (1.5) ★LFBGA352-1616 352 TFBGA064-0606 64 6x 6 6.0 x 6.0 x (1.2) LFBGA144-0909 140 9x 9 9.0 x 9.0 x (1.4) LFBGA160-1010 160 10 x 10 10.0 x 10.0 x (1.4) / (1.6) TFBGA180-1313 180 13 x 13 13.0 x 13.0 x (1.2) 0.65 LFBGA192-1010 192 10 x 10 10.0 x 10.0 x (1.4) / (1.6) LFBGA208-1212 208 12 x 12 12.0 x 12.0 x (1.4) / (1.6) LFBGA224-1313 224 13.0 x 13.0 x (1.4) / (1.6) 13 x 13 (Plastic) TFBGA260-1313 260 13.0 x 13.0 x (1.2) * Figures in brackets indicate available terminal counts. 60

PACKAGES ★Under development ●Surface-mount Type (cont’d) Package Terminal pitch Nominal dimensions Package width & length Appearance Package code No. of terminals x (seated height [MAX.]) type (Package material) mm mm mm LFBGA064-0606 64 6.0 x 6.0 x (1.1) TFBGA068-0606 68 VFBGA081-0606 81 6x 6 6.0 x 6.0 x (0.9) TFBGA084-0606 84 6.0 x 6.0 x (1.1) VFBGA100-0606 6.0 x 6.0 x (0.9) VFBGA100-0707 100 7.0 x 7.0 x (0.9) TFBGA100-0707 7.0 x 7.0 x (1.1) VFBGA108-0707 7.0 x 7.0 x (0.9) 108 7x 7 TFBGA108-0707 7.0 x 7.0 x (1.1) VFBGA120-0707 7.0 x 7.0 x (0.9) 120 TFBGA120-0707 7.0 x 7.0 x (1.1) VFBGA144-0808 8.0 x 8.0 x (0.9) 8x 8 Packages LFBGA144-0808 144 8.0 x 8.0 x (1.3) / (1.5) LFBGA144-0811 0.5 8 x 11 8.0 x 11.0 x (1.3) TFBGA152-0808 152 8x 8 8.0 x 8.0 x (1.1) FBGA VFBGA171-0811 8.0 x 11.0 x (0.9) (CSP) 171 8 x 11 LFBGA171-0811 8.0 x 11.0 x (1.3) / (1.5) VFBGA176-0909 9.0 x 9.0 x (0.9) 176 TFBGA176-0909 9x 9 9.0 x 9.0 x (1.1) TFBGA180-0909 180 VFBGA188-1111 11 x 11 11.0 x 11.0 x (0.9) 188 TFBGA188-0909 9x 9 9.0 x 9.0 x (1.1) VFBGA208-1010 10.0 x 10.0 x (0.9) 208 TFBGA208-1010 10 x 10 10.0 x 10.0 x (1.1) TFBGA245-1010 245 LFBGA245-1010 10.0 x 10.0 x (1.3) FBGA424-1414 424 14 x 14 14.0 x 14.0 x (1.8) WFBGA144-0606 144 6.0 x 6.0 x (0.75) 6x 6 ★WFBGA121-0606 121 6.0 x 6.0 x (0.8) 0.4 TFBGA168-0707 168 7x 7 7.0 x 7.0 x (1.0) (Plastic) TFBGA204-0808 204 8x 8 8.0 x 8.0 x (1.0) 61

LSI PACKAGES ★Under development ●Surface-mount Type (cont’d) Package Terminal pitch Nominal dimensions Package width & length Appearance Package code No. of terminals x (seated height [MAX.]) type (Package material) mm mm mm TFBGAXXX-0606 to 36 6x 6 6.0 x 6.0 x (1.2) TFBGAXXX-0707 to 49 7x 7 7.0 x 7.0 x (1.2) TFBGAXXX-0808 to 81 8x 8 8.0 x 8.0 x (1.2) TFBGAXXX-0909 to 100 9x 9 9.0 x 9.0 x (1.2) TFBGAXXX-1010 to 121 10 x 10 10.0 x 10.0 x (1.2) TFBGAXXX-1111 to 144 0.8 11 x 11 11.0 x 11.0 x (1.2) TFBGAXXX-1212 to 196 12 x 12 12.0 x 12.0 x (1.2) TFBGAXXX-1313 to 216 13 x 13 13.0 x 13.0 x (1.2) TFBGAXXX-1414 14 x 14 14.0 x 14.0 x (1.2) to 240 TFBGAXXX-1515 15 x 15 15.0 x 15.0 x (1.2) TFBGAXXX-1616 to 280 16 x 16 16.0 x 16.0 x (1.2) TFBGAXXX-0606 to 49 6x 6 6.0 x 6.0 x (1.2) TFBGAXXX-0707 to 81 7x 7 7.0 x 7.0 x (1.2) TFBGAXXX-0808 to 121 8x 8 8.0 x 8.0 x (1.2) TFBGAXXX-0909 to 144 9x 9 9.0 x 9.0 x (1.2) TFBGAXXX-1010 to 196 10 x 10 10.0 x 10.0 x (1.2) TFBGAXXX-1111 to 224 0.65 11 x 11 11.0 x 11.0 x (1.2) TFBGAXXX-1212 to 256 12 x 12 12.0 x 12.0 x (1.2) TFBGAXXX-1313 to 272 13 x 13 13.0 x 13.0 x (1.2) FBGA TFBGAXXX-1414 to 304 14 x 14 14.0 x 14.0 x (1.2) (CSP) TFBGAXXX-1515 to 320 15 x 15 15.0 x 15.0 x (1.2) TFBGAXXX-1616 to 352 16 x 16 16.0 x 16.0 x (1.2) TFBGAXXX-0606 to 100 6x 6 6.0 x 6.0 x (1.1) TFBGAXXX-0707 to 132 7x 7 7.0 x 7.0 x (1.1) TFBGAXXX-0808 to 164 8x 8 8.0 x 8.0 x (1.1) TFBGAXXX-0909 to 192 9x 9 9.0 x 9.0 x (1.1) TFBGAXXX-1010 to 216 10 x 10 10.0 x 10.0 x (1.1) TFBGAXXX-1111 to 244 0.5 11 x 11 11.0 x 11.0 x (1.1) TFBGAXXX-1212 to 268 12 x 12 12.0 x 12.0 x (1.1) TFBGAXXX-1313 to 296 13 x 13 13.0 x 13.0 x (1.1) TFBGAXXX-1414 to 320 14 x 14 14.0 x 14.0 x (1.1) TFBGAXXX-1515 to 348 15 x 15 15.0 x 15.0 x (1.1) TFBGAXXX-1616 to 372 16 x 16 16.0 x 16.0 x (1.1) TFBGAXXX-0505 to 100 5x 5 5.0 x 5.0 x (1.0) TFBGAXXX-0606 to 144 6x 6 6.0 x 6.0 x (1.0) TFBGAXXX-0707 to 168 7x 7 7.0 x 7.0 x (1.0) 0.4 TFBGAXXX-0808 to 204 8x 8 8.0 x 8.0 x (1.0) TFBGAXXX-0909 to 228 9x 9 9.0 x 9.0 x (1.0) (Plastic) TFBGAXXX-1010 to 264 10 x 10 10.0 x 10.0 x (1.0) FLGA XFLGA100-0707 100 0.5 7x 7 7.0 x 7.0 x (0.5) (LGA) (Plastic) ★PBGA0356-2121 356 1.0 21 x 21 21.0 x 21.0 x (2.2) PBGA PBGA0476-3535 476 (BGA) 1.27 35 x 35 35.0 x 35.0 x (2.63) PBGA0528-3535 528 XXX: Terminal counts 62

PACKAGES ●Surface-mount Type (cont’d) Package No. of Terminal pitch Nominal dimensions Package width & length Lead frame material Appearance Package code x (seated height [MAX.]) type (Package material) terminals mm (mil) mm (mil) mm Alloy42 Copper alloy SOP P-SOP044-0600 44 1.27 (50) 15.2 (600) 13.2 x 28.2 x (3.1) P-SSOP008-0150 8 0.65 4.5 (150) 3.0 x 3.0 x (1.1) – P-SSOP012-0225 12 0.75 5.7 (225) 4.4 x 5.0 x (1.8) – SSOP P-SSOP024-0275 24 7.0 (275) 6.0 x 7.8 x (1.27) – 0.65 P-SSOP040-0300 40 7.6 (300) 6.3 x 13.5 x (1.8) – P-SSOP070-0500 70 0.8 12.7 (500) 12.7 x 28.6 x (3.05) – P-MFP018 18 0.8 – MFP – 6.0 x 7.5 x (1.8) (Plastic) P-MFP020 20 0.75 – P-TSOP040-1020 40 10 x 20 10.0 x 18.4 x (1.2) TSOP P-TSOP048-1220 48 0.5 12 x 20 12.0 x 18.4 x (1.2) (Plastic) P-TSOP056-1420 56 14 x 20 14.0 x 18.4 x (1.2) P-QFP048-0707 0.5 7x 7 7.0 x 7.0 x (1.65) – 48 Packages P-QFP048-1010 0.75 10.0 x 10.0 x (1.82) – P-QFP064-1010 64 10 x 10 – QFP 10.0 x 10.0 x (1.8) P-QFP072-1010 72 0.5 – P-QFP128-1420 128 – 14 x 20 14.0 x 20.0 x (2.3) P-QFP156-1420 156 0.4 – P-LQFP080-1212 80 12 x 12 12.0 x 12.0 x (1.7) – P-LQFP100-1414 100 14 x 14 14.0 x 14.0 x (1.7) – 0.5 LQFP P-LQFP144-2020 144 20 x 20 20.0 x 20.0 x (1.7) – P-LQFP176-2424 176 24 x 24 24.0 x 24.0 x (1.7) – ★ P-LQFP256-2828 256 0.4 28 x 28 28.0 x 28.0 x (1.7) – P-TQFP048-0707 48 7x 7 7.0 x 7.0 x (1.2) – 0.5 TQFP P-TQFP100-1414 100 – 14 x 14 14.0 x 14.0 x (1.2) (Plastic) P-TQFP128-1414 128 0.4 – P-VQFN020-0404 20 4x 4 4.2 x 4.2 x (1.0) – P-VQFN028-0505 28 – 5x 5 5.2 x 5.2 x (1.0) P-VQFN032-0505 32 0.5 – P-VQFN036-0606 36 6x 6 6.2 x 6.2 x (1.0) – VQFN P-VQFN048-0707 48 7x 7 7.2 x 7.2 x (1.0) – P-VQFN036-0505 36 5x 5 5.2 x 5.2 x (1.0) – P-VQFN052-0707 52 0.4 7x 7 7.2 x 7.2 x (1.0) – P-VQFN064-0808 64 8x 8 8.2 x 8.2 x (1.0) – P-HQFN010-0202A 2.0 x 2.0 x (0.35) – 10 ★ P-HQFN010-0202B 0.4 2x 2 2.2 x 2.2 x (0.35) – ★ P-HQFN014-0202 14 2.2 x 2.2 x (0.55) – P-HQFN016-0303 0.5 3x 3 3.0 x 3.0 x (0.85) – 16 HQFN* P-HQFN016-0404 0.65 – 4.0 x 4.0 x (1.0) P-HQFN020-0404 20 – 4x 4 4.0 x 4.0 x (0.85) – P-HQFN024-0404 24 0.5 4.2 x 4.2 x (1.0) – P-HQFN028-0505 28 5x 5 5.0 x 5.0 x (1.0) – (Plastic) P-HQFN052-0707 52 0.4 7x 7 7.2 x 7.2 x (1.0) – * HQFN is a higher heat dissipation package of VQFN. 100 mil = 2.54 mm 63

LSI PACKAGES ●For CCDs No. of Terminal pitch Nominal dimensions Package width & length Package Appearance x (seated height) Package code type (Package material) terminals mm mm (mil) mm P-DIP014-0400A 14 1.27 10.16 (400) 10.0 x 10.0 P-DIP016-0500C 16 1.78 12.7 (500) 12.4 x 14.0 DIP P-DIP020-0400 20 1.00 10.16 (400) 10.0 x 10.0 (Plastic) N-DIP016-0450 1.27 11.43 (450) 11.4 x 12.2 16 N-DIP016-0500C 1.78 12.7 (500) 12.4 x 14.0 (Ceramic) P-SOP028-0400 28 0.69 10.16 (400) 10.0 x 10.0 x (3.5) SOP P-SOP032-0525 32 0.78 13.3 (525) 12.0 x 13.8 x (3.9) (Plastic) N-LCC028-S450A 28 0.80 11.5 11.5 x 11.5 x (1.62) LCC N-LCC032-R543 32 0.80 13.8 12.9 x 13.8 x (1.35) (Ceramic) 100 mil = 2.54 mm Nominal dimensions FBGA (CSP) SOP QFP FLGA (LGA) SSOP TSOP LQFP PBGA (BGA) MFP TQFP VQFN DIP LCC HQFN FBGA : fine-pitch ball grid array package QFP : quad flat package FLGA : fine-pitch land grid array package LQFP : low profile quad flat package PBGA : plastic ball grid array package TQFP : thin quad flat package SOP : small outline package VQFN : very thin quad flat non-leaded package SSOP : shrink small outline package HQFN : heat sink quad flat non-leaded package MFP : mini flat package DIP : dual inline package TSOP : thin small outline package LCC : leadless chip carrier 64

PACKAGES ●Lead-inserting Type Packages [For regulators: PQ series] Appearance No.of Terminal pitch Outline dimensions Lead frame Package type (Package material) terminals mm (Width x Thickness x Height) mm material TO-220 (Heat sink exposure) 5 (1.7)*1 10.2 (MAX.) x 3.5 x 25.2*2 Cu [Lead forming type] (Plastic) A TO-220 4 2.54 10.2 (MAX.) x 4.5 x 29.1*2 Cu (Plastic) B TO-220 4 2.54 10.2 (MAX.) x 4.5 x 29.1*2 Cu (Full mold) (Plastic) Packages C TO-220 (Full mold) 5 (1.7)*1 10.2 (MAX.) x 4.5 x 24.6*2 Cu [Lead forming type] (Plastic) D TO-220 5 (1.7)*1 10.2 (MAX.) x 4.5 x 24.6*2 Cu [Lead forming type] (Plastic) E TO-220 5 (1.7)*1 10.2 (MAX.) x 4.5 x 24.6*2 Cu [Lead forming type] (Plastic) TO-92 3 2.5 5.2 (MAX.) x 4.2 (MAX.) x 18.2 (MAX.)*2 Cu (Plastic) *1 The figure in parentheses indicates reference value. *2 Including lead length ●Surface-mount Type Packages [For regulators/LED drivers: PQ series] Appearance No.of Terminal pitch Outline dimensions Lead frame Package type (Package material) terminals mm (Width x Height x Thickness) mm material 5 TO-263 (Heat sink (1.7)*1 10.6 (MAX). x 13.7 (MAX.)*2 x 3.5 Cu not included) (Plastic) F 5 SC-63 (Heat sink (1.27)*1 6.6 (MAX.) x 9.7 (MAX.)*2 x 2.3 Cu not included) (Plastic) G 5 SC-63 (1.27)*1 6.6(MAX.) x 9.7 (MAX.)*2 x 2.1 Cu (Heat sink included) (Plastic) SOP-8 8 1.27 5 x 6.2*2 x 1.55*2 Cu (Plastic) *1 The figure in parentheses indicates reference value. *2 Including lead length 65

LSI PACKAGES ●Surface-mount Type Packages [For regulators/LED drivers: PQ series] (cont’d) Appearance No.of Terminal pitch Outline dimensions Lead frame Package type (Package material) terminals mm (Width x Height x Thickness) mm material SOT-89 6 1.5 4.5 x 4.3*2 x 1.5 Cu (Plastic) SOT-23-6 6 0.95 2.9 x 2.8*2 x 1.3 Cu (Plastic) SOT-23-6W 6 0.95 2.9 x 2.8*2 x 1.3 Cu (Plastic) SOT-23-L 6 (0.95)*1 (3.4)*1 x 3.3*2 x 1.4 (MAX.) Cu (Plastic) SOT-23-5 5 (0.95)*1 (2.9)*1 x 2.8*2 x 1.3 (MAX.) Cu (Plastic) Cu (Terminal material)/ USB-6 6 0.5 2.0 x 1.8 x 0.8 Au plating (Terminal finish) USB-10 10 0.5 2.8 x 2.0 x 0.8 — *1 The figure in parentheses indicates reference value. *2 Including lead length The companies listed below own the trademarks of the relevant LSIs. ARM, ARM7TDMI, ARM720T, ARM922T, ARM946E-S, ARM926EJ-S and Developer Suite are trademarks of ARM Ltd. Windows is a trademark of Microsoft Corporation. Ball Grid Array and BGA are trademarks of Motorola Nippon Ltd. RSDS is a trademark of National Semiconductor Corporation. Java and Java Card are trademarks of Sun Microsystems, Inc. SmartMedia is a trademark of Toshiba Corporation. Z80 is a trademark of ZiLOG, Inc. CompactFlash is a trademark of SanDisk Corporation. MIPS, MIPS32, 4KSd are trademarks of MIPS Technologies, Inc. QUALCOMM and MSM are trademarks of QUALCOMM Incorporated. IrSS and IrSimple are trademarks of Infrared Data Association®. Bluetooth is a trademark of Bluetooth SIG, Inc. All other product or company names are trademarks of their respective holders. Notice In the absence of conﬁrmation by device speciﬁcation sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device speciﬁcation sheets before using any SHARP device. 66

POWER SWITCHING POWER SUPPLY ■ Switching Power Supplies (Custom) ◆ Features (1) Satisfies energy saving regulations thanks to the high conversion efficiency (2) Compact and high reliability thanks to the modulated main switching and chopper circuits (3) EMI filter built-in, low noise design (4) Environmentally safe types are also available. [RoHS, lead-free] ◆ Specification examples LCD TV LCD TV Laser-beam printer/ Applications (20 to 22′′) (26 to 32′′) Scanner/FAX Input voltage (V AC) 90 to 110 90 to 264 85 to 138 Input frequency (Hz) 50/60 50/60 50/60 +24 (5.0 A) +3.3 (0.25 A) +12 (4.0 A) Output voltage (V) +24 (1.9 A) +5 (1.1 A) +5 (5.5 A) (Current capacity) +12 (3.5 A) +12 (0.13 A) +5 (1.5 A) +24 (2.0 A) +3.3 (3.0 A) Rated output power (W) 87.6 213 55.9 0.3 Stand-by power loss (W) 0.1 – (without load) Protection circuit Overcurrent and overvoltage protection Conﬁguration On-board Outline dimensions (mm) 118 × 208 × 36 140 × 244 × 35.6 204 × 124 × 40 * Types with input voltage of AC 100 V, 120 V, 200 V are also available. Types with other specification are also available upon request. For LCD TVs (20′′ to 22′′), an integrated power source with an inverter circuit for backlights is also available. ■ Switching Power Supply with Integrated High/Low Voltage Circuit (Custom) ◆ Features (1) Realizes compact and low cost thanks to the integrated high/low voltage circuit (2) Easy connection between high voltage and low voltage circuits (3) Highly efficiency energy saving power supply at standby mode can be installed for low voltage circuit (4) Environmentally safe types are also available. [RoHS, lead-free] ◆ Specifications Sharp ‘Green Power Supply’ adapting with integrated high/low voltage circuit regulation Switching power supply system Pulse width control or RCC method High Input voltage (V DC) 24 voltage Output voltage (kV DC) +5.5 (+280 µA)/-5.5 (-560 µA), etc. Switching power supply system Pulse width control or RCC method Low Input voltage (V AC) 100, 120, 230 voltage Power capacity (W) 184 Power Supply Device Notice In the absence of conﬁrmation by device speciﬁcation sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device speciﬁcation sheets before using any SHARP device. 137