PACKAGES
SOF
●SOF
(System On Film)
SOF is a highly flexible thin film package, created from SHARP’s TCP technologies.
It can be easily bent, and contributes to thin and compact design of products.
Peripheral circuit components can also be mounted.
Highly flexible and thin film package
By using highly flexible and thin film, SOF contributes to creating thin and compact products.
It can also achieve finer terminal pitches and multiple outputs easily, and pattern layout on a film under the chip
makes it possible to improve the flexibility of the pattern layout.
Features
Multiple chip mounting
Bare chip
Cu pattern
Thickness 0.6 mm (MIN.)
1.0 mm (TYP.)
Cross
section
example
Solder resist
38
µm
Under fill material Gold bump
Film width : W
1
Maximum pattern layout area : W
2
Maximum device pitch : L
Copper foil thickness
Copper foil type
Copper foil plating
Minimum pattern pitch
Sprocket hole : A
Sprocket hole : B
35 mm super wide
28.6 mm
48 mm super wide
41.6 mm
15 sprockets
8
µm
Rolled or electrolytic
Tin (Sn)
0.029 mm
1.981 mm (wide) /1.42 mm (super wide)
1.981 mm (wide) /1.42 mm (super wide)
70 mm wide
59.0 mm
Film
specifications
A
B
4.75 mm
Sprocket hole pitch
Maximum pattern layout area
W
1
W
2
L
Other components
Bare chips and peripheral circuit components can be mounted on the film.
In addition to the SOF described above, a conventional TCP (Tape Carrier Package) is also available.
59
Packages
Plural bare chip mounting and incorporation of peripheral components contribute to the higher functionality
of products.
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