LSI
LGA
●LGA
(Land Grid Array Package)
The LGA package has basically the same structure as the CSP, enabling a thin package by removing
the solder balls from the bottom of the package. The LGA package contributes to the compact and
thinner design of applications, such as mobile phones and digital cameras.
PACKAGES
Lower package height
Achieves 0.5 mm Max. in package height.
High reliability
Comparable high reliability with that of conventional plastic package.
Features
Excellent mountability
Conventional mounting system is available for LGA. SOP and QFP can be mounted together with LGA.
Terminal pitch
Maximum terminal count
Nominal dimensions
0.5 mm
216 (10 mm x 10 mm)
6 mm x 6 mm ~ 10 mm x 10 mm
Bare chip
Gold wire
Mold resin
Cross
section
example
Package height
0.5 mm (MAX.)
Cu pattern
Substrate
Terminal pitch : 0.5 mm
Land
56
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