(Land Grid Array Package)
The LGA package has basically the same structure as the CSP, enabling a thin package by removing
the solder balls from the bottom of the package. The LGA package contributes to the compact and
thinner design of applications, such as mobile phones and digital cameras.
Lower package height
Achieves 0.5 mm Max. in package height.
Comparable high reliability with that of conventional plastic package.
Conventional mounting system is available for LGA. SOP and QFP can be mounted together with LGA.
Maximum terminal count
216 (10 mm x 10 mm)
6 mm x 6 mm ~ 10 mm x 10 mm
0.5 mm (MAX.)
Terminal pitch : 0.5 mm