Since reliability can be affected adversely by improper storage environ-
ment or handling methods during Characteristic tests, please observe the
A larger contact area between the device and the heatsink is required for
more effective heat radiation. To ensure a larger contact area, minimize
mounting holes. And select a heatsink with a surface smooth enough and
free from burrs and slivers.
Cautions for Storage
that storage conditions comply with the normal temperature (5 to
35°C) and the normal relative humidity (around 40 to 75%), and avoid
storage locations that experience high temperature and humidity, or
extreme changes in temperature or humidity.
locations where dust or harmful gases are present, and avoid
the devices for rust in leads and solderability after stored for a
In general, the device mounted on a printed circuit board is subjected to
high temperatures from flow solder in a solder bath, or, from a soldering
iron at hand soldering.
The testing method and test conditions (JIS-C-7021 standards) for a
device's heat resistance to soldering are:
At a distance of 1.5mm from the device's main body, apply 260°C for 10
seconds, and 350°C for 3 seconds.
Please observe these limits and finish soldering in as short a time as
Cautions for Characteristic Tests and Handling
On characteristics test at incoming inspection, etc, take good care to avoid
the surge voltages from the test equipment, the short circuit at terminals,
or the wrong connection.
Antistatic measure for power MOS FET Arrays
handling the device, body grounding is necessary. Wear a wrist
strap with a 1 MΩ resistor close to the body in the wrist strap to prevent
a conductive tablemat and a floor mat at the device-handling
workbench and ground them properly.
using a curve tracer or other measuring equipment, ground them
soldering, ground the soldering iron tip and the solder bath to prevent
a leakage voltage from damaging the device.
an antistatic measure for device containers, use Sanken shipping
containers or a conductive containers, or use aluminum foils.
Since reliability can be affected adversely by improper storage
environment or handling methods during Characteristic tests, please
observe the following cautions.
When using a heatsink, please coat thinly and evenly the back surface of
the device and both surfaces of the insulating plate with silicone grease to
lower the thermal resistance between the device and the heatsink.
Please select proper silicone grease carefully since the oil in some grease
products may penetrate the device and result in an extremely short device
Recommended Silicone Grease
• G-746 (Shin-Etsu Chemical)
• YG6260 (GE Toshiba Silicones)
• SC102 (Dow Corning Toray Silicone)
When mounting torque is insufficient, thermal resistance increases, and so
heat radiation effect is decreased. When the torque is excessive, the
screw may be broken, the heatsink may be deformed, and the device
frame may be distorted, resulting in the device damage. Recommended
mounting torque per package is as follows:
Mounting Torque Table
MT-200 (fixed at two points)
SIP with Fin (SLA)
0.490 to 0.686 N•m (5 to 7kgf•cm)
0.686 to 0.882 N•m (7 to 9kgf•cm)
0.588 to 0.784 N•m (6 to 8kgf•cm)
* When the surface of a heatsink where Full Mold package is to be
mounted is not flat due to the burred metal bracket for screwing around
the mounting hole of the heatsink, the resin of the package might be
cracked even if the torque is lower than the recommended value.
* When a screw is fastened with an air driver for the Full Mold package, a
large impact is generated at the time of stop, and the resin may crack
even if the torque is lower than the recommended value. An electric
driver, therefore, should be used instead of an air driver.