SI-3000LU Series
sExternal
Dimensions (SOT89-5)
4.5
±0.05
1.6
±0.05
4.2
±0.05
t
4.2
±0.05
4.2
±0.05
r
0.4
±0.03
0.1
±0.05
(Unit : mm)
2.5
±0.05
4.3
±0.05
(
φ
1
.0
±
0.0
5
)
Pin Assignment
q
A
DJ
w
GND
e
V
C
r
V
IN
t
V
O
Plastic Mold Package Type
Flammability: UL94V-0
Product Mass: Approx. 0.05g
0.40
q
w
e
sBlock
Diagram
SI-3012LU
V
IN
4
5 V
O
V
IN
4
0.4
±0.05
1.5
±0.05
1.5
±0.05
1.5
±0.05
0.90
±0.1
4.2
±0.05
4.7
±0.05
4.2
±0.05
0.90
±0.1
SI-3018LU, SI-3033LU, SI-3050LU
5 V
O
V
C
3
TSD
+
–
1 A
dj
3
TSD
1 A
dj
2 GND
+
–
2 GND
REF
REF
sStandard
External Circuit
SI-3018LU, SI-3033LU, SI-3050LU
V
IN
4
V
O
5
V
DJ
1
2
GND
C
O
+
C
IN
Load
V
C
3
+
SI-3012LU
V
IN
C
IN
4
3
1
2
GND
V
C
R
2
C
O
5
V
O
R
1
C
O
: Output capacitor (10
µ
F or larger)
For SI-3000LU series, Co has to be a low ESR capacitor such as a
ceramic capacitor.
C
IN
: Input capacitor (10
µ
F approx.)
Setting of SI-3012LU output voltage (recommended voltage: 1.5 V to 15 V)
R1 and R2: Resistors for output setting
The output voltage can be set by connecting R1 and R2 as shown in the
diagram on the left.
R2: 100 kΩ is recommended
R1=(V
O
–V
ADJ
)/(V
ADJ
/R2)
•
+
V
IN
+
Load
sReference
Data
Copper Laminate Area vs Power Dissipation
T
j
=100°C PCB size 40
×40
1
Ta=25°C
0.9
Ta=40°C
Ta=60°C
Ta=85°C
Power Dissipation P
D
(W)
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
10
• A monolithic ICs mounts an inner frame stage that is connected to the
GND pin (pin 2). Therefore, enlarging the copper laminate area connected
to the GND pin improves heat radiation effect.
• Obtaining the junction temperatureMeasure the temperature T
C
at the lead
part of the GND pin (pin 2) with a thermocouple, etc. Then, substitute this
value in the following formula to obtain the junction temperature.
T
j
=P
D
×θ
j–c+Tc (
θ
j–c=5
°
C/W)
100
1000
Copper Laminate Area (mm
2
)
Case temperature Tc
measurement point
ICs
9