SI-8000JD Series
sExternal
Dimensions (TO263-5)
Case Temperature Measurement Point
10.0
±0.2
(Unit : mm)
±0.2
(0.40)
1.2
9.90
(15°)
±0.2
(8.0)
4.5
3-R0.3
±0.2
(4.4)
1.3
–0.05
+0.10
(4.6)
(1.75)
(6.8)
±0.2
9.2
±0.2
φ
1.5 Dp:
±0.2
(3°)
(2×R0.45)
(3°)
±0.1
0.10
(3°)
2.4
(R0.3)
±0.3
±0.2
±0.2
2.0
15.30
±0.15
0.88
±0.10
(R0.3)
0~6
°
±0.1
(0.5)
(1.7
±0.25
)
1
2
3
4
5
0.8
±0.25
)
(1.7
±0.1
Pin Assignment
q
V
IN
w
SW
OUT
e
GND
r
V
OS
t
ON/OFF
Plastic Mold Package Type
Flammability: 94V-0
Product Mass: Approx. 1.48g
9.2±
±0.3
15.3
±0.3
(0.75)
4.9
2.54
(1.7
±0.25
)
0.8
±0.25
(1.7
)
(3°)
2-R0.3
10.0
±0.02
(3°)
sBlock
Diagram
sTypical
Connection Diagram
L1
V
IN
1
V
IN
SW
2
4
+
Di
V
OUT
SW OUT
1
V
IN
PReg.
OCP
2
4.9
±0.2
SI-8000JD
C
1
+
ON/OFF GND
5
3
C
3
V
S
5 ON/OFF
ON/OFF
Soft
Start
Reset
OSC
+
C
2
Latch &
Drive
GND
Comp.
Error Amp.
+
GND
TSD
4
V
REF
GND
3
C
1
C
2
C
3
L
1
Di
:
:
:
:
:
50V/220
µ
F
25V/470
µ
F
10V/0.47
µ
F (Only when using soft-start function)
100
µ
H
SJPB-H6 (Sanken)
sReference
Data
Copper Laminate Area on Glass Epoxy Board vs.
Thermal Resistance (Junction to Ambient Air) (Typical Value)
Thermal Resistance (junction to ambient air)
θ
j-a (°C/W )
55
50
45
40
35
30
0
2.6
2.4
2.2
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
Output Current vs. Power Dissipation (Typical)
With glass epoxy board of 40
×
40 mm
Power Dissipation
Pd (W)
40V
30V
20V
V
IN
8V
200
400
600
800
1000
1200
1400
1600
1800
Copper Laminate Area (mm
2
)
0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
Output Current I
O
(A)
sT
a
-P
D
Characteristics
3.5
3
Copper Area
40×40 mm
(
θ
j-a : 33.3°C/W)
20×40 mm
(
θ
j-a : 37°C/W)
20×20 mm
(
θ
j-a :44°C/W)
10×10 mm
(
θ
j-a : 53°C/W)
P
D
=V
O
·I
O
100
ηχ
–1 –V
F
·I
O
1–
V
O
V
IN
Power Dissipation P
D
(W)
2.5
2
1.5
1
0.5
The efficiency depends on the input voltage and the output current. Therefore, obtain the value
from the efficiency graph and substitute the percentage in the formula above.
V
O
: Output Voltage
V
IN
: Input Voltage
I
O
: Output Current
ηχ
: Efficiency (%)
V
F
: D
1
forward voltage
0.4V(I
O
=2A)(SJPB-H6)
Thermal design for D
1
must be considered separately.
0
–25
0
25
50
75
100
125
Ambient Temperature T
a
(°C)
ICs
51
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