SI-8000W Series
sExternal
Dimensions (SOP8)
5.1
±0.4
1.27
0.4
±0.1
0.15
+0.1
–0.05
(Unit : mm)
8
7
6
5
1
2
3
4
1.27
0.995max.
1.55
±0.15
0~1
0
°
Pin Assignment
q
V
IN
w
N.C
e
SW
OUT
r
V
OS
t
GND
y
GND
u
GND
i
GND
Plastic Mold Package Type
Flammability: UL94V-0
Product Mass: Approx. 0.1g
4.4
±0.2
0.5
±0.1
0.05
±0.05
1.5
±0.1
6.2
±0.3
0.10
0.4
±0.1
0.12 M
sBlock
Diagram
V
IN
1
OCP
Reg.
3 SW
OUT
sTypical
Connection Diagram
L1
200µH
V
IN
1
V
IN
SW
OUT
3
4
D
1
SJPB-D4
(Sanken)
+
V
O
OSC
Reset
Drive
Comp.
TSD
SI-8000W
C
1
100µF
+
GND
5~8
V
OS
Amp.
V
REF
5~8
4 V
OS
C
2
330µF
GND
GND
GND
sReference
Data
Copper Laminate Area vs. Power Dissipation
1.2
Tj=100°C Area of PC board : 40
×
40mm
Ta=25°C
1
Power Dissipation
P
D
(W)
Copper Laminate Area vs. Thermal Resistance
θ
j-a
140
Area of PC board : 40
×
40mm
Ta=50°C
120
Thermal Resistance
θ
j-a (°C/W)
Ta=80°C
0.8
100
0.6
0.4
80
60
0.2
0
10
100
Copper Laminate Area
(mm
2
)
(GND Terminal)
1000
40
10
100
Copper Laminate Area
(mm
2
)
(GND Terminal)
1000
ICs
49