SAI Series
sExternal
Dimensions (PS4)
±0.25
max.
±0.2
(unit : mm)
2 SW
3V
OS
4
.GND
0.75
–0.05
+0.15
1V
IN
±0.15
4.7
a
b
1.4
6.8
max.
±0.2
a. Part Number
b. Lot Number
A Case Temperature Measuring Point
Pin Assignment
q
V
IN
w
SW
OUT
e
V
OS
r
GND
Plastic Mold Package Type
Flammability: UL94V-0
Product Mass: Approx. 0.22g
0.89
2.54
4.32
3.6
±0.2
A
8.0
±0.5
±0.2
4.0
max.
6.3
0~0.15
1.0
±0.3
3.0
9.8
±0.2
±0.3
0.3
–0.05
0.25
+0.15
sBlock
Diagram
V
IN
1
OCP
Reg.
OSC
2 SW
OUT
sTypical
Connection Diagram
3.3
V
5
V
: 200µH
9
V
12
V
15
V
: 300µH
V
O
V
IN
1
V
IN
SW
OUT
L1
2
3
SAI
Reset
Drive
Comp.
3 V
OS
GND
V
OS
TSD
C
1
100µF
+
GND
4
SFPB54
(Sanken)
D
1
+
C
2
330µF
Amp.
V
REF
4
GND
GND
sT
a
-P
D
Characteristics
0.8
0.7
P
D
=V
O
•I
O
• Glass epoxy
board
(95
×
69
×
1.2)
• Natural air cooling
100
–1
ηχ
–V
F
•I
O
1–
V
O
V
IN
Power Dissipation P
D
(W)
0.6
0.5
0.4
0.3
0.2
0.1
0
–30
0
25
The efficiency depends on the input voltage and the output
current. Therefore, obtain the value from the efficiency graph
and substitute the percentage in the formula above.
V
O
: Output voltage
I
O
: Output current
ηχ
: Efficiency (%)
V
F
: Diode D
1
forward voltage
SFPB54-0.3V
50
75
100
125
Ambient Temperature T
a
(°C)
Thermal design for D
1
must be considered separately.
ICs
47
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