SI-3000KS Series
sExternal
Dimensions (SOP8)
5.1
±0.4
1.27
0.4
±0.1
0.15
+0.1
–0.05
0.5
±0.1
(Unit : mm)
Pin Assignment
q
V
C
w
V
IN
e
V
O
r
Sence (ADJ for SI-3012KS)
t
GND
y
GND
u
GND
i
GND
Plastic Mold Package Type
Flammability: UL 94V-0
Product Mass: Approx. 0.1 g
8
7
6
5
4.4
±0.2
1
2
3
4
1.27
0.995max.
1.55
±0.15
1.5
±0.1
0.10
0.4
±0.1
0.12 M
sBlock
Diagram
qSI-3012KS
qSI-3018KS,
SI-3025KS, SI-3033KS
V
IN
2
3 V
OUT
V
IN
2
0.05
±0.05
3 V
OUT
0~1
0
°
6.2
4
V
C
1
-
+
4 ADJ
TSD
8
7
REF
6
5 GND
V
C
1
-
+
Sense
TSD
8
7
REF
6
5 GND
sTypical
Connection Diagram
qSI-3012KS
V
IN
2
+
qSI-3018KS,
SI-3025KS, SI-3033KS
V
O
3
V
IN
2
V
O
3
C
O
R1
C
O
C
IN
V
C
GND ADJ
1
4
5 to 8
Load
C
IN
sense
V
C
GND 4
1
5 to 8
Load
R2
R2
R
1
, R
2
: Output voltage setting resistors
The output voltage can be set by connecting R
1
and R
2
as shown above.
The recommended value of R
2
is 24 kΩ .
C
IN
: Input capacitor (22
µ
F or larger)
C
O
: Output capacitor (22
µ
F or larger)
For SI-3000KS series, Co has to be a low ESR capacitor.
When using the electrolytic capacitor, the SI-3000KS series may oscillate at a low temperature.
R1=(V
O
–V
ADJ
)
÷
(V
ADJ
/R2)
sReference
Data
Copper Laminate Area vs.
Thermal Resistance
140
Area of PC board : 40×40mm
1.2
Copper Laminate Area vs.
Power Dissipation
Tj=100°C Area of PC board : 40×40mm
Ta=25°C
Thermal resistance
θ
j-a (°C/W)
120
Power dissipation P
D
(W)
1
Ta=50°C
Ta=80°C
0.8
100
• Obtaining the junction temperature
Measure the temperature T
L
at the lead part of the GND
pin (pin 7) with a thermocouple, etc. Then, substitute
this value in the following formula to obtain the junction
temperature.
0.6
0.4
T
j
=P
D
× θ
j–L
+ T
L
(
θ
j–L
= 22
°
C/W)
80
60
0.2
40
10
100
Copper laminate area (mm
2
)
(GND terminal)
1000
0
10
100
Copper laminate area (mm
2
)
(GND terminal)
1000
ICs
13
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