SI-3000LSA Series
sExternal
Dimensions (SOP8)
5.1
±0.4
1.27
0.4
±0.1
0.15
+0.1
–0.05
0.5
±0.1
(Unit : mm)
8
7
6
5
1
2
3
4
1.27
0.995max.
1.55
±0.15
1.5
±0.1
Pin Assignment
q
V
IN
w
NC (Leave open)
e
V
IN
r
V
C
t
GND
y
GND
u
V
O
i
V
O
Plastic Mold Package Type
Flammability: UL94V-0
Product Mass: Approx. 0.1g
4.4
±0.2
0.10
0.4
±0.1
0.12 M
sBlock
Diagram
V
IN
1
8
V
O
0.05
±0.05
NC 2
+
–
V
IN
3
TSD
01
~ 0
7 V
O
6
°
6.2
GND
V
C
4
5
GND
sTypical
Connection Diagram
V
IN
C
IN
1
2
3
4
V
IN
GND
V
C
C
O
8
7
6
5
V
O
sReference
Data
PCB Copper Laminate Area vs. Junction to
Ambient Air Thermal Resistance
150
140
130
0.8
Load
+
+
C
O
: Output capacitor (22
µ
F or larger)
C
IN
: Input capacitor (10
µ
F)
This capacitor is required in the case of an inductive input line or long
wiring.
Tantalum capacitors are recommended for C
IN
and C
O
, particularly at
low temperatures.
* Leave pin 2 open.
Allowable Output Current
(vs. V
IN
-V
OUT
Voltage Difference)
V
IN
-I
O
max
1.2
PCB (glass-epoxy, 40×40mm)
160mm (40×40) mm
T
j
= 120°C (20% derating of 150°C)
1.0
I
out (
max) (A)
θ
j-a
(°C/W)
120
110
100
90
θ
j-a
=100°C/W
0.6
The inner frame stage, on which the PTr is mounted,
is directly connected to the V
OUT
pin.
Therefore, enlarging the copper laminate area
around the V
OUT
pin is really effective for a heat
radiation.
0.4
T
a
=25°C
T
a
=85°C
0.2
80
70
100
0
1000
5000
1
2
3
4
Copper Laminate Area (mm
2
)
V
IN
-V
OUT
Voltage Difference (V)
ICs
11