Package Mounting Methods
4) Reflow
For reflow soldering, it is necessary to set the individual optimum temperature conditions according to the mounting
conditions. At our company, we recommend mounting by hot air flow reflow, but infrared radiation systems can also be
used without problems. The recommended temperature profile is shown in Figure 12. For details, refer to the product
specifications.
10s max.
max. 260
200
Temperature (°C)
50s max.
170
140 to 160°C
60 to 120s
Time (s)
Figure 12 Reflow temperature profile
5) Storage
Environments containing high humidity, dust, or harmful gases (hydrochlorides, sulfuric acid gases, hydrosulfides) may
cause deterioration of the soldering characteristics of the external electrodes. Avoid storage in areas subject to high
temperatures and humidity.
M
M21