Package Explanation
Package classification
Packages are classified as shown below according to the package shape and the method for mounting the package on the
printed-circuit board.
Surface-mount
type
(SMD)
Dual type
SOP, ESOP, HSOP,
SSOP
SOJ
SON
Quad type
QFP, HQFP, LQFP,
TQFP, QFH
QFJ
QFS
QFN, HQFN
Area array type
BGA, FBGA, HBGA,
MBGA, UBGA
LGA, FLGA, MLGA,
ULGA, XLGA
Transistor, Diode
package
ML
PAM, CQF
Mini, SMini,
SSMini, SSSMini
SO, TSSONF, HSOP
U, N, I, TO-220C
Through-hole
type
(THD)
Single type
SIP, HSIP, SSIP
ZIP, HZIP
Dual type
DIP, HDIP, SDIP
WDIP
Matrix type
Transistor, Diode
package
PGA
TO-92, TO-126,
TO-220, TOP, NS, MT
U, N, I
DIP
DO-34, DO-35, DO-41
M2
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