ECA - ECRS = ECA Cross Reference Search

<Surface-mount Package Type> ............................................................................................................................................................ L2

Package Information................................................................................................................................................................................................... M1

Package classification................................................................................................................................................................................... M2

Shipment/Packaging................................................................................................................................................................................................... M3

Packaging forms ........................................................................................................................................................................................... M4

Determining packaging style from part number ............................................................................................................................................ M5

Diodes .................................................................................................................................................................................................... M5

Transistors ............................................................................................................................................................................................. M5

Discrete Devices ........................................................................................................................................................................................... M6

Embossed taping ................................................................................................................................................................................... M6

Package Mounting Methods ....................................................................................................................................................................................... M7

Selection of mounting materials.................................................................................................................................................................... M8

1. Printed circuit board design ...................................................................................................................................................................... M8

Desirable conditions for printed circuit boards ....................................................................................................................................... M8

Warpage and heat for surface mounting ................................................................................................................................................ M8

Printed circuit board selection ................................................................................................................................................................ M9

Mounting density and package spacing ............................................................................................................................................... M10

Solder resist region .............................................................................................................................................................................. M10

Layout of semiconductor devices......................................................................................................................................................... M10

2. Selection of solder material..................................................................................................................................................................... M11

Desired performance before reflow ...................................................................................................................................................... M11

Desired performance during/after reflow .............................................................................................................................................. M11

Cleaning characteristics ....................................................................................................................................................................... M11

Environmental factors .......................................................................................................................................................................... M11

3. Selection of adhesive.............................................................................................................................................................................. M12

4. Selection of cleaning agents ................................................................................................................................................................... M12

5. Processes prior to mounting ................................................................................................................................................................... M13

Lead shaping/cutting process .............................................................................................................................................................. M13

Points requiring care for moistureproof packaged products................................................................................................................. M14

6. Mounting process.................................................................................................................................................................................... M15

Mount ................................................................................................................................................................................................... M15

Applying solder to printed circuit board (for reflow soldering) .............................................................................................................. M15

Soldering .............................................................................................................................................................................................. M16

Multiple cycle reflow ............................................................................................................................................................................. M17

Cleaning ............................................................................................................................................................................................... M17

7. Points requiring care for special packages ............................................................................................................................................. M18

Points requiring care for power devices ............................................................................................................................................... M18

Points requiring care for LGA (C-CSP/L-CSP) and BGA ..................................................................................................................... M20

Precautions when Using Semiconductor Products................................................................................................................................................... M23

Package Outlines ........................................................................................................................................................................................................N1

Reference Dimension of Soldering pad .......................................................................................................................................................................R1

Discontinued, Maintenance and Planned Maintenance Types.................................................................................................................................... P1

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