WLP-24-3 (–)
Package Outline
0.6
±0.05
0.2
±0.05
STANDOFF
0.1 C
1.95
±0.05
4 x 0.4 = 1.6
0.4
A
20
21
16
11
7
2
3
22
17
12
23
18
13
8
4
24
19
14
9
5
B
15
10
6
1
C
0.25
±0.04 1)
24x
ø0.05
M
A B
Pin 1
Corner Index Area
2)
0.08 C
24x
COPLANARITY
1) Dimension is measured at the maximum solder ball diameter, parallel to primary datum C
2) Pin 1 corner identified by marking
3) Primary datum C and seating plane are defined by the spherical crowns of the balls
Foot Print
Packages
0.4
1.6
1.6
0.4
0.25
Marking Layout
Manufacturer
123456
YYWW
Type Code
Date code (YYWW)
Packing
Reel ø180 mm = Pieces/Reel
4
±0.1
2.42
±0.05
0.25
±0.1
8
Pin 1 Corner
Index Area
1)
1) Balls face down
2.42
±0.05
0.95
±0.05
79
Ty p e L is t
Cross Reference
Packaging Info
Selection Guide
SEATING PLANE
3)
4 x 0.4 = 1.6
0.4
2.07
±0.05
Application Fields
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