WLP-16-1 (–)
Package Outline
0.65
±0.05
0.25
±0.05
STANDOFF
0.1 C
1.96
±0.05
3 x 0.5 = 1.5
0.5
A
16
12
11
10
9
8
7
6
5
4
3
2
1
B
14
13
C
0.3
±0.05 1)
16x
ø0.05
M
A B
Pin 1
Corner Index Area
2)
0.08 C
16x
COPLANARITY
1) Dimension is measured at the maximum solder ball diameter, parallel to primary datum C
2) Pin 1 corner identified by marking
3) Primary datum C and seating plane are defined by the spherical crowns of the balls
Foot Print
Packages
Manufacturer
Type Code
Date code (YYWW)
0.25
±0.1
2.42
±0.05
1
0.5
1.5
0.5
0.25
0.5
1.96
±0.05
15
Marking Layout
123456
YYWW
Packing
Reel ø180 mm = Pieces/Reel
4
±0.1
8
Pin 1 Corner
Index Area
1)
1) Balls face down
2.42
±0.05
0.95
±0.05
Ty p e L is t
77
Cross Reference
Packaging Info
Selection Guide
SEATING PLANE
3)
3 x 0.5 = 1.5
Application Fields
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