WLP-11-1 (–)
Package Outline
0.65
±0.05
0.25
±0.05
STANDOFF
0.1 C
1.6
±0.05
2 x 0.5 = 1
0.5
12
8
7
6
5
4
3
2
B
A
SEATING PLANE
3)
10
9
C
0.3
±0.05 1)
11x
ø0.05
M
A B
Pin 1
Corner Index Area
2)
0.08 C
11x
COPLANARITY
1) Dimension is measured at the maximum solder ball diameter, parallel to primary datum C
2) Pin 1 corner identified by marking
3) Primary datum C and seating plane are defined by the spherical crowns of the balls
Foot Print
1
0.5
1.5
0.5
0.25
Marking Layout
Manufacturer
12345678
YYWW
Type Code
Date code (YYWW)
Packing
Reel ø180 mm = Pieces/Reel
4
±0.1
0.25
±0.1
2.28
±0.1
Corner
Index Area
1)
1.85
±0.1
8
±0.3
0.95
±0.1
1) Balls face down
76
0.5
2.1
±0.05
11
3 x 0.5 = 1.5
Home Index Bookmark Pages Text
Previous Next
Pages: Home Index