WLP-8-1 (–)
Package Outline
0.65
±0.05
0.25
±0.05
STANDOFF
SEATING PLANE
3)
1.6
±0.05
2 x 0.5 = 1
0.1 C
0.5
B
A
9
8
7
6
5
4
3
2
C
0.5
0.3
±0.05 1)
8x
ø0.05
M
A B
Pin 1
Corner Index Area
2)
0.08 C
8x
COPLANARITY
1) Dimension is measured at the maximum solder ball diameter, parallel to primary datum C
2) Pin 1 corner identified by marking
3) Primary datum C and seating plane are defined by the spherical crowns of the balls
Foot Print
1
0.5
1
0.5
0.25
Marking Layout
Manufacturer
12345
YYWW
Type Code
Date code (YYWW)
Packing
Reel ø180 mm = Pieces/Reel
4
±0.1
0.25
±0.1
1.75
±0.1
8
±0.1
Corner
Index Area
1)
1.75
±0.1
1.15
±0.15
1) Balls face down
Ty p e L is t
75
Cross Reference
Packaging Info
Packages
Selection Guide
2 x 0.5 = 1
1.6
±0.05
0.5
Application Fields
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