TSLP-7-4 (–)
Package Outline
Top view
0.05 MAX.
0.4
+0.1
Bottom view
1.5
±0.05
1.1
±0.05
4
5
6
4
7
1
2
3
1.9
±0.05
7
3
Pin 1 marking
1) Dimension applies to plated terminal
6 x 0.3
±0.035 1)
2
1
Foot Print
0.3
0.3
S MD
0.25
1.4
0.25
2.2
0.175
2.2
2.2
2.2
0.25
0.25
0.25
0.175
0.3
0.3
0.3
Stencil apertures
Stencil apertures
Marking Layout (Example)
BGA619
Type code
2005, 25 CW
Date code (YYWW)
Packing
Reel ø180 mm = 7.500 Pieces/Reel
4
2.48
8
0.5
Pin 1
marking
1.65
73
Ty p e L is t
Cross Reference
Pin 1 marking
Laser marking
Packaging Info
0.3
Solder mask
Copper
0.25
0.3
0.3
0.3
0.25
0.25
0.25
0.3
Solder mask
Copper
0.25
Packages
For board assembly information please refer to Infineon website "Packages"
1.4
1.4
1.4
NSMD
0.25
0.25
0.175
2.3
±0.05
5
1.1
±0.035 1)
6
1.4
±0.035 1)
0.25
0.25
0.175
Selection Guide
6 x
0.3
±0.035 1)
Application Fields
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