TSLP-7-1 (–)
Package Outline
Top view
0.4
+0.1
0.05 MAX.
4
6
Bottom view
1.3
±0.05
1
±0.05
5
6
1.7
±0.05
7
1
2
3
7
3
Pin 1 marking
2
1
6 x 0.2
±0.035 1)
1) Dimension applies to plated terminal
Foot Print
For board assembly information please refer to Infineon website "Packages"
0.2
0.2
0.2
1.4
NSMD
0.2
1.4
1.4
S MD
0.2
2
±0.05
4
6 x 0.2
±0.035 1)
1.2
±0.035 1)
1.1
±0.035 1)
5
1.4
0.2
0.25
0.2
1.9
0.2
0.25
1.9
1.9
1.9
0.2
0.2
0.2
0.25
0.2
0.3
0.3
Copper
0.3
0.25
Stencil apertures
R0.1
0.3
0.3
Copper
0.3
0.2
0.25
0.25
0.25
Stencil apertures
R0.1
Solder mask
Solder mask
Marking Layout (Example)
BGA619
Type code
2005, 25 CW
Date code (YYWW)
Pin 1 marking
Laser marking
Packing
Reel ø180 mm = 7.500 Pieces/Reel
4
0.5
2.18
Pin 1
marking
1.45
72
8
0.2
0.25
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