TSLP-6-1 (–)
Package Outline
Top view
0.4
+0.1
0.05 MAX.
Bottom view
2 x 0.23
±0.035 1)
0.8
±0.05
0.45
±0.05
3
4
2
5
6
5
6
2
1
3
1
Pin 1 marking
2 x
0.35
±0.035 1)
4 x
0.15
±0.035 1)
1) Dimension applies to plated terminal
Foot Print
For board assembly information please refer to Infineon website "Packages"
0.25
4 x 0.23
±0.035 1)
0.55
±0.05
1.2
±0.05
4
0.8
0.185
0.8
0.76
0.25
R0.125
1.12
1.12
0.25
0.25
0.185
0.29
0.25
0.22
Only 100 µm stencil thickness
recommended
Stencil apertures
0.37
0.18
Copper
0.25
Marking Layout (Example)
BFS360L6
Type code
Packing
Reel ø180 mm = 15.000 Pieces/Reel
4
0.5
1.45
8
Pin 1
marking
1.05
Ty p e L is t
71
Cross Reference
Pin 1 marking
Laser marking
Packaging Info
Solder mask
Packages
Selection Guide
0.87
±0.05
Application Fields
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