TSLP-4-7 (–) – Reduced Height
Package Outline
Top view
0.39
+0.01
-0.03
0.05 MAX.
4 x
0.25
±0.035
1)
Bottom view
4 x 0.35
±0.035
4
1)
0.8
±0.05
0.75
±0.05
2
3
4
1
2
1
Pin 1 marking
1) Dimension applies to plated terminal
0.45
±0.05
Foot Print
For board assembly information please refer to Infineon website "Packages"
0.8
0.4
0.78
0.38
1.18
0.28
0.3
0.2
Copper
0.3
Solder mask
0.22
0.28
Stencil apertures
Marking Layout (Example)
BAR90-07LRH
Type code
Pin 1 marking
Laser marking
Packing
Reel ø180 mm = 15.000 Pieces/Reel
0.5
1.45
8
4
Pin 1
marking
1.05
70
0.38
0.4
0.42
1.2
0.4
1.2
±0.05
3
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