TSLP-4-4 (–)
Package Outline
Top view
0.4
+0.01
0.05 MAX.
4 x
0.25
±0.035 1)
2
3
Bottom view
4 x 0.35
±0.035
1)
0.8
±0.05
4
1
2
1
4
Pin 1 marking
1) Dimension applies to plated terminal
0.45
±0.05
Foot Print
For board assembly information please refer to Infineon website "Packages"
1.2
±0.05
3
0.8
0.4
0.78
0.38
1.18
0.28
0.3
0.2
Copper
0.3
Solder mask
0.22
0.28
Marking Layout (Example)
BAR90-07L4
Type code
Pin 1 marking
Laser marking
Packing
Reel ø180 mm = 15.000 Pieces/Reel
0.5
1.45
8
4
Pin 1
marking
1.05
69
Ty p e L is t
Cross Reference
Packaging Info
Stencil apertures
0.38
0.4
0.42
1.2
0.4
Packages
Selection Guide
0.75
±0.05
Application Fields
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