TSLP-3-9 (–) – Low Height
Package Outline
Top view
0.31
+0.01
-0.02
Bottom view
0.6
±0.05
0.5
±0.035 1)
0.575
±0.05
3
2
0.4
±0.035 1)
1
3
1
2
0.35
±0.05
Pin 1
marking
2 x 0.15
±0.035 1)
1) Dimension applies to plated terminal
Foot Print
For board assembly information please refer to Infineon website "Packages"
0.6
R0.19
0.45
0.2
0.95
0.38
0.5
0.255
0.35
0.225
0.15
Copper
0.225
Solder mask
0.2
0.2
0.17
R0.1
Stencil apertures
Marking Layout (Example)
BFR705L3RH
Type code
Pin 1 marking
Laser marking
Packing
Reel ø180 mm = 15.000 Pieces/Reel
4
1.2
0.35
Pin 1
marking
0.8
68
8
0.315
1
2 x
0.25
±0.035 1)
1
±0.05
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