TSLP-3-8 (–) – Reduced Height
Package Outline
Top view
0.39
+0.01
-0.03
0.05 MAX.
Bottom view
0.6
±0.05
0.5
±0.035 1)
0.4
±0.035 1)
3
2
3
1
2
1
0.35
±0.05
Pin 1
marking
2 x 0.15
±0.035 1)
1) Dimension applies to plated terminal
Foot Print
For board assembly information please refer to Infineon website "Packages"
2 x
0.25
±0.035 1)
0.6
R0.19
0.45
0.2
0.95
0.38
0.5
0.35
0.225
0.15
Copper
0.225
Solder mask
0.2
0.2
0.17
R0.1
Marking Layout
Type code
Packing
Reel ø180 mm = 15.000 Pieces/Reel
4
1.16
0.5
8
Pin 1
marking
0.76
67
Ty p e L is t
Cross Reference
Laser marking
Packaging Info
Stencil apertures
Packages
0.255
0.315
1
Selection Guide
0.575
±0.05
1
±0.05
Application Fields
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