TSLP-3-7 (–) – Reduced Height
Package Outline
Top view
Bottom view
2)
Cathode
marking
0.6
±0.05
0.5
±0.035
0.65
±0.05
1)
0.05 MAX.
3
2
1
±0.05
1
2 x 0.25
±0.035
0.315
1)
3
1
2
Pin 1
marking
0.35
±0.05
2 x 0.15
±0.035
1)
1) Dimension applies to plated terminal
2) Only for diodes, cathode marking on pin 3
Foot Print
For board assembly information please refer to Infineon website "Packages"
0.45
0.6
0.275
0.35
0.35
0.945
0.3
1
0.2
0.225
0.225
0.15
Copper
Solder mask
R0.1
0.2
0.17
Stencil apertures
Marking Layout
Type code
0.355
Type code
Pin 1 marking
Cathode marking
Standard
Only for diodes, cathode marking on pin 3
Packing
Reel ø180 mm = 15.000 Pieces/Reel
Standard
4
1.16
Only for diodes, cathode marking on pin 3
4
1.16
0.5
8
Pin 1
marking
0.76
Cathode
marking
0.76
66
8
0.25
±0.035
0.39
+0.01
-0.03
1)
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