TSLP-3-1 (SC-101)
Package Outline
Top view
Bottom view
0.6
±0.05
0.5
±0.035
0.65
±0.05
1)
0.05 MAX.
3
2
1
±0.05
1
2 x 0.25
±0.035
0.45
1)
3
1
2
Pin 1
marking
0.35
±0.05
2 x 0.15
±0.035
1)
1) Dimension applies to plated terminal
Foot Print
For board assembly information please refer to Infineon website "Packages"
0.275
0.6
0.35
0.35
0.945
0.3
1
0.355
R0.1
0.2
0.225
0.225
0.15
Copper
Solder mask
0.2
0.17
Stencil apertures
Marking Layout (Example)
BFR193L3
Type code
Pin 1 marking
Laser marking
Packing
Reel ø180 mm = 15.000 Pieces/Reel
4
1.16
0.5
Pin 1
marking
0.76
64
8
0.315
0.25
±0.035
0.4
+0.1
1)
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