TSLP-2-7 (–) – Reduced Height
Package Outline
Top view
0.39
+0.01
-0.03
Bottom view
0.65
±0.05
2
2
1
1
Cathode
marking
0.5
±0.035 1)
1) Dimension applies to plated terminal
Foot Print
For board assembly information please refer to Infineon website "Packages"
0.25
±0.035 1)
0.35
0.45
0.3
0.925
1
0.275
0.6
Copper
Solder mask
Stencil apertures
0.275
0.35
0.375
Marking Layout (Example)
BAR90-02LRH
Type code
Packing
Reel ø180 mm = 15.000 Pieces/Reel
Reel ø330 mm = 50.000 Pieces/Reel (optional)
4
1.16
0.5
8
Cathode
marking
0.76
63
Ty p e L is t
Cross Reference
Cathode marking
Laser marking
Packaging Info
Packages
Selection Guide
0.05 MAX.
0.6
±0.05
1
±0.05
Application Fields
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