TSLP-2-1 (–)
Package Outline
Top view
0.05 MAX.
0.4
+0.1
Bottom view
0.6
±0.05
2
0.65
±0.05
2
1
1
1)
1)
Cathode
marking
1) Dimension applies to plated terminal
Foot Print
For board assembly information please refer to Infineon website "Packages"
0.35
0.45
0.3
0.925
1
0.275
0.275
0.375
0.6
Copper
Solder mask
0.35
Stencil apertures
Marking Layout (Example)
BAS16-02L
Type code
Cathode marking
Laser marking
Packing
Reel ø180 mm = 15.000 Pieces/Reel
Reel ø330 mm = 50.000 Pieces/Reel (optional)
4
1.16
0.5
Cathode
marking
0.76
62
8
0.25
±0.035
0.5
±0.035
1
±0.05
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