TSSLP-2-1 (–)
Package Outline
Top view
0.31
+0.01
-0.02
Bottom view
0.32
±0.035
0.355
±0.025
2
2
1
1
Cathode
marking
0.26
±0.025 1)
1) Dimension applies to plated terminal
Foot Print
For board assembly information please refer to Infineon website "Packages"
0.2
±0.025 1)
0.24
0.32
0.14
0.62
0.57
0.19
0.27
Copper
Solder mask
0.24
Stencil apertures
0.19
0.19
Marking Layout (Example)
BAR95-02LS
Type code
Packing
Reel ø180 mm = 15.000 Pieces/Reel
4
0.73
0.35
8
Cathode
marking
0.43
Ty p e L is t
61
Cross Reference
Pin 1 marking
Laser marking
Packaging Info
Packages
Selection Guide
0.62
±0.035
Application Fields
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