HAT2009F
Power vs. Temperature Derating
2.0
Pch (W)
I
D
(A)
Test Condition :
When using the glass epoxy board
(40 x 40 x 1.6 mm)
1.5
100
30
10
3
Maximum Safe Operation Area
10 µs 100 µs
PW
DC
Op
1m
Channel Dissipation
Drain Current
=
s
1.0
1
Dr
ive
1
10
0.5
Op
er
a
er
Operation in
at
ion
0.3 this area is
**
limited by R
DS(on)
0.1
ms
2
iv e
Dr
pe
O
tio
n
ra
tio
n
0
50
100
150
Ta (°C)
200
Ambient Temperature
0.03 Ta = 25 °C
0.01 1 shot Pulse
0.1 0.3
1
3
10
30
100
Drain to Source Voltage V
DS
(V)
** When using the glass epoxy board
(40 x 40 x 1.6 mm)
20
Typical Output Characteristics
10 V 5 V
20
3V
4.5 V
4V
3.5 V
Typical Transfer Characteristics
V
DS
= 10 V
Pulse Test
I
D
(A)
12
I
D
Drain Current
2.5 V
(A)
2V
16
16
12
Drain Current
8
8
Tc = 75°C
4
25°C
–25°C
1
2
3
Gate to Source Voltage
4
V
GS
(V)
5
4
V
GS
= 1.5 V
Pulse Test
0
2
4
6
Drain to Source Voltage
8
V
DS
(V)
10
0
3