HAT2004F
Power vs. Temperature Derating
2.0
Pch (W)
I
D
(A)
Test Condition :
When using the glass epoxy board
(40 x 40 x 1.6 mm)
1.5
100
30
10
3
Maximum Safe Operation Area
10 µs 100 µs
PW
DC
1 ms
Channel Dissipation
Drain Current
1.0
1
Dr
ive
0.5
Op
er
0m
Op
s
1
er
at
Operation in
ion
0.3 this area is
**
limited by R
DS(on)
0.1
0.03 Ta = 25 °C
1 shot pulse
0.01
0.1 0.3
1
3
10
30
100
Drain to Source Voltage V
DS
(V)
** 1 Drive Operation
When using the glass epoxy board
(40 x 40 x 1.6 mm)
=1
2
iv
Dr
e
e
Op
at
ion
ra
n
tio
0
50
100
150
Ta (°C)
200
Ambient Temperature
Typical Output Characteristics
20
10 V
5V
4V
3.5 V
3V
(A)
20
Typical Transfer Characteristics
V
DS
= 10 V
Pulse Test
16
–25°C
12
I
D
(A)
16
25°C
Tc = 75°C
12
Drain Current
8
Drain Current
I
D
2.5 V
2V
8
4
V
GS
= 1.5 V
Pulse Test
0
2
4
6
Drain to Source Voltage
8
V
DS
(V)
10
4
0
1
2
3
Gate to Source Voltage
5
4
V
GS
(V)
3
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