HAT1009F
Power vs. Temperature Derating
2.0
Pch (W)
Test Condition :
When using the glass epoxy board
(40 x 40 x 1.6 mm)
1.5
–100
I
D
(A)
–30
–10
–3
–1
Maximum Safe Operation Area
10 µs 100 µs
PW
DC
1
=
m
Channel Dissipation
Drain Current
s
2
Dr
1.0
1
0.5
Dr
ive
Op
er
at
ion
10
Op
m
s
er
Operation in
at
–0.3 this area is
ion
**
limited by R
DS(on)
–0.1
ive
Op
er
at
ion
–0.03
150
Ta (°C)
200
0
50
100
Ambient Temperature
–0.01
–1
–3
–10 –30 –100
–0.1 –0.3
Drain to Source Voltage V
DS
(V)
** 1 Drive operation
When using the glass epoxy board
(40 x 40 x 1.6 mm)
Ta = 25 °C
1 shot pulse
–10
Typical Output Characteristics
–10 V –5 V
–4 V
–3.5 V
–3 V
Pulse Test
(A)
–2.5 V
Typical Transfer Characteristics
–10
25 °C
Tc = –25 °C
75 °C
I
D
(A)
–8
–8
I
D
–2 V
Drain Current
V
GS
= –1.5 V
–6
–6
Drain Current
–4
–4
–2
–2
V
DS
= –10 V
Pulse Test
0
–1
–2
–3
Gate to Source Voltage
–4
–5
V
GS
(V)
0
–2
–4
–6
Drain to Source Voltage
–10
V
DS
(V)
–8
3
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