2SK2315
Power vs. Temperature Derating
1.6
Channel Dissipation Pch** (W)
(** on the almina ceramic board)
I
D
(A)
5
2
Maximum Safe Operation Area
100 µs
PW
1
1.2
1
0.5
=
m
s
10
m
s
C
D
Drain Current
0.8
0.2
0.1
0.05
0.02
0.01
Operation in
this area is
limited by R
DS(on)
O
r
pe
n
io
at
0.4
Ta = 25 °C
1 shot pulse
0.5 1
2
5
10 20
50 100 200
0
50
100
150
Ta (°C)
200
0.005
0.2
Ambient Temperature
Drain to Source Voltage
V
DS
(V)
Typical Output Characteristics
5
10 V
5V
4V
3.5 V
(A)
Ta = 25 °C
Pulse Test
3V
Typical Transfer Characteristics
5
I
D
(A)
4
4
Tc = 75 °C
25 °C
–25 °C
I
D
2.5 V
Drain Current
2V
V
GS
= 1.5 V
3
3
Drain Current
2
2
1
1
V
DS
= 10 V
Pulse Test
1
2
3
Gate to Source Voltage
4
V
GS
(V)
5
0
2
4
6
Drain to Source Voltage
8
V
DS
(V)
10
0
3