6. Handling Instruction
(1) Insulation between pins
High voltages are applied between the pins of the numbers specified below. Hitachi advises to apply
coating or molding treatment.
1 - 2, 2 - 4, 6 - 7, 8 - 9, 9 - 10, 20 -21, 21- 22, 22 -23
Coating resin comes in various types. There are some unclear points as to how much thermal and
mechanical stresses are exercised on semiconductor devices by size, thickness, and other factors of
board shape, and the effects of other components. In selecting coating resin, please consult with your
(2) Connection of tabs (radiator panels of the ICs)
Fig. 6-1 is a cross section of the IC. The tab and the GL pin of the IC are connected with high
impedance (Rp = hundreds of KΩ to several MΩ).
Set the tab potential to open or GND.
If the tab is mounted on the external cabinet of the motor for heat radiation purpose, the IC cannot
withstand an isolation withstand voltage test where a high voltage is applied between the external
cabinet and the ground. Please apply a mylar sheet or something similar between the IC tab and the
To GL pin
Fig. 6-1. Cross section of Hitachi
(3) Soldering conditions
The peak temperature of flow soldering* must be less than 260
C, and the dip time must be less than
10 seconds. High stress by mounting, such as long time thermal stress by preheating, mechanical
stress, etc, can lead to degradation or destruction. Make sure that your mounting method does not
cause problem as a system.
* Flow soldering: Only pins enter a solder bath, while the resin or tab does not.