IC-SP-06027 R0
7-2. Quality Control Flow
Process
Flow
1
2
3
4
5
6
7
8
9
Process Classinfication
No.
Process name
1
Control Item
Control Method
Contents
Sampling
Sampling
All
Sampling
Sampling
Sampling
Sampling
Sampling
Sampling
All
Remarks
[Process symbols]
: Incoming
: Inspection
: Processing or
machining
Resistivity
Sillicon Wafer incoming
Wefer receive insupection
Thickness
inspection
DI condition
Photo lithography
condition
Diffusion condition
Metal evaporation
condition
Surface protection film
deposition condition
Grinding condition
Metal evaporation
condition
Electrical characteristic
Appearance Size
Pattern Form
Resistivity Gate
oxidation thickness
Thickness
Appearance
Thickness
Appearance
Wafer thickness
Appearance
Thickness
Appearance
Electrical
characteristic
2 DI (dielectric isolation)
3 Photo lithography
4 Diffusion
5 Metal evaporation
6
Surface protection film
deposition
7 Back grinding
8 Back metal evaporation
9 Wafer Probing
Assembling parts
incoming inspection
10
10
Assembling parts receive
Appearance Size
inspection
Dicing condition
Appearance
Appearance
Appearance
Appearance
Appearance
Appearance
Appearance
Appearance
Sampling
11
12
13
14
15
16
17
18
11 Dicing
Sampling
Sampling
Sampling
Sampling
Sampling
Sampling
Sampling
Sampling
12 Pellet appearance check Appearance
13 Die bonding
14 Joining
15 Wire bonding
16 Molding
17 Lead plating
18
Marking
Cutting bending
Assembly final
appearance check
Bonding condition
Joining condition
Wire bonding condition
Molding condition
Lead plating condition
Marking condition
Appearance
Appearance
Characteristic
Appearance
Characteristic
Appearance
Checking
19
19
Appearance
Characteristic
Appearance
Characteristic
Appearance Size
Type The number
Inventory code
Type The number
Inventory code
Sampling
20
20 Screening
21 Final check
All
Sampling
21
22
22 Store
Sampling
23
23 Shipping inspection
Checking
Sampling
24 Packing
・
Shipping
Shipping guide
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31
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