6. Handling Instruction
(1) Insulation between pins
High voltages are applied between the pins of the numbers specified below. Hitachi advises to apply
coating or molding treatment.
1 - 2, 2 - 4, 6 - 7, 8 - 9, 9 - 10, 20 -21, 21- 22, 22 -23
Coating resin comes in various types. There are some unclear points as to how much thermal and
mechanical stresses are exercised on semiconductor devices by size, thickness, and other factors of
board shape, and the effects of other components. In selecting coating resin, please consult with your
(2) Connection of tabs (radiator panels of the ICs)
Fig. 6-1 is a cross section of the IC. The tab and the GL pin of the IC are connected with high
impedance (Rp = hundreds of KW to several MW).
Set the tab potential to open or GND.
If the tab is mounted on the external cabinet of the motor for heat radiation purpose, the IC cannot
withstand an isolation withstand voltage test where a high voltage is applied between the external
cabinet and the ground. Please apply a mylar sheet or something similar between the IC tab and the
To GL pin
Fig. 6-1. Cross section of Hiatchi
(3) Soldering conditions
Hitachi's inverter ICs (packages SP-23TA, SP-23TB, and SP-23TR) can be used in flow soldering* with
a peak temperature of less than 260 C and a dip time of no more than 10 seconds.
*: Flow soldering: The lead pin alone enters the solder basin, while the resin or tab does not.