Hitachi IGBT Module Application Manual
Figure 55. Clamping Order for Four-point Clamping Module
6.1.4 Surface Roughness and Warp of Heat Sink
(1)
(2)
(3)
(4)
The surface roughness of the heat sink should not be less than
∇∇
(25S).
The convex or concave warp of heat sink should not be more than 100
µ
m
(between the mounting screw holes).
Confirm that the surface of the heat sink is free of burrs.
Be sure to chamfer the screw holes.
Always be certain to look for and remove all foreign substances, such as cut
chips, which may get caught between the IGBT module and heat sink.
6.1.5 Heat Sink Mounting Hole Diameter
Select the mounting hole diameter suited to the screw to be used.
Note:
If the heat sink mounting hole diameter is too large, the module’s
base may be deformed and the dice in the module damaged as shown
in Figure 56.
Figure 56. Example of Improper Heat Sink Mounting
chamfering value.
Table 8. Recommended Mounting Hole Diameter and Chamfering Value
No.
1
2
3
4
Screw
M4
M5
M6
M8
Mounting Hole Diameter
(in mm.)
φ
5
φ
6
φ
7.5
φ
9.5
Recommended Chamfering Value
(in mm.)
C 0.5
C 0.5
C 0.5
C 0.5
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